“…III C. Another fundamental ingredient in the understanding of the EM damage of interconnects is represented by the granular structure of the materials employed, Al, Cu, Ag, Al alloys, etc. 1-3 Furthermore, it must be noted that a high degree of disorder is usually present in alloy films (typically Al-Cu, Al-Si) due to alloying effects 2, 10,11,[28][29][30] and to thermal gradients. 1,2 A large number of models has been proposed for the study of EM.…”