1974
DOI: 10.1098/rspa.1974.0138
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Resistance of superconducting-normal interfaces

Abstract: The work of Pippard, Shepherd & Tindall (P. S. T.) on the resistance of copper foil sandwiched between superconducting lead electrodes has been extended (1) to study the influence of alloying the lead with bismuth, (2) to investigate other pairs of metals, Pb-Re, Pb-Mo, Pb-Al, Pb-Sn, Sn-Al. In addition, different techniques for depositing lead electrodes on copper foil have been investigated; evaporation in vacuo after cleaning the copper surface by sputtering has been found to give… Show more

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Cited by 34 publications
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