Resistance to Electrical Corrosion of Au-Cu Alloy Coatings for Electronic Contacts

Abstract

In order to obtain electronic contacts with good performance, Au-Cu alloy coatings with different gold contents were prepared on copper substrates by direct current electrodeposition and were tested against electrochemical corrosion and arc corrosion. The experimental results showed that the hardness of the Au-Cu alloy was in the range of 115.2 HV~171.6 HV, which meets the requirements of electronic contact materials. The polarization curve (Tafel) test and electrochemical impedance spectroscopy (EIS) test results indicated that the electrochemical corrosion resistance of Au-Cu alloy plating was much better than pure copper. With the rise of gold content in the alloy coatings, the corrosion resistance of the alloy coatings enhanced gradually. Compared with pure copper, the Au-Cu alloy coatings showed more stable contact resistance. After 1000 contacts, the resistivity of the alloy with 75% gold varied from 72 mΩ to 78 mΩ, whereas under the same conditions, the resistivity of copper changed from 14 mΩ to 78 mΩ. Anode-type material transfer occurred after 1000 contacts with a reduction in the total mass of each contact element. The mass loss of Au75Cu25 and Au86Cu14 contact elements was lower than that of pure copper. The Au-Cu alloy coatings displayed excellent arc corrosion resistance when the gold content in the alloy plating was higher than 75%.