Organic–inorganic hybrid perovskites (OIHPs) have
emerged
as potential candidates for active layers in resistive switching memory
(RSM) devices and have recently attracted much interest in academia
and industry. In RSM devices based on the OIHPs, grain boundaries
play an important role in the formation of resistive switching paths
because the grain boundary regions contain many defects that favor
the formation of conducting filaments. In this study, the effect of
methylammonium lead iodide (MAPbI3)/indium tin oxide (ITO)
substrates with various post-treatments on RSM devices is demonstrated.
To reduce the defect density, variation of the immersion time of the
MAPbI3 surface in CsI, MABr, and CsBr solutions promotes
grain size enlargement and decreases the number of grain boundaries.
The largest average grain size of the OIHP film obtained with 10 s
of CsBr solution immersion (CsBr-10 s) for RSM devices is 1386.5 nm,
and the corresponding photoluminescence (PL) intensity demonstrates
the highest signal. The grain size can be well controlled by varying
the immersion time in the ionic solution, and the appropriate post-treatment
time is 10 s. Compared to untreated OIHP devices (on/off current ratio
∼102), perovskite film (MAPbI3)-based
RSM devices with CsBr-10 s achieve a > 105 on/off current
ratio and >104 s data retention. The conduction mechanism
of the RSM devices with proper immersion treatment switches from the
space-charge-limited current (SCLC) mechanism to Poole–Frenkel
(PF) emission. This observation confirms that a low density of defects
from fewer grain boundaries for RSM devices makes the conducting filaments
in the memristors more susceptible to activation. Most OIHP-based
devices suffer from humidity damage issues; however, the device fabrication
and storage in our experiment are performed in ambient air. The results
indicate that perovskite memory based on suitable ionic solution immersion
exhibits great potential for use in future high-performance memristors.