Resonance-aware methodology for system level power distribution network co-design

Shayan, Amirali; Bowles, Kevin; Dobre, Sorin; Popovich, Mikhail; Chen, Xiaoming; Pan, Christopher

doi:10.1109/epeps.2009.5338484

Cited by 3 publications

(1 citation statement)

References 3 publications

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“…1). This capacitance can resonate with a parasitic inductance [4], [5], and causes potential bounce on the planes [6]. In a case both planes are for ground, the antiresonance causes the potential fluctuation in phase on the power and ground lines; we call it "package-common-mode resonance".…”

Section: Introductionmentioning

confidence: 98%

Experimental verification of signal integrity deterioration due to package-common-mode resonance

Nishimoto

Asai

Matsushima

et al. 2012

International Symposium on Electromagnetic Compatibility - EMC EUROPE

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When an LSI package is mounted on a PCB, parasitic couplings are unintentionally generated between them. Antiresonance of these couplings (package-common-mode resonance) can cause degradation of signal and power integrity. In this paper, the authors experimentally verified the packagecommon-mode resonance by comparing scattering parameters with variation of CMOS output jitter. In order to suppress increase of the jitter, resister-dumping method was tested as a countermeasure.

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Section: Introductionmentioning

confidence: 98%

Experimental verification of signal integrity deterioration due to package-common-mode resonance

Nishimoto

Asai

Matsushima

et al. 2012

International Symposium on Electromagnetic Compatibility - EMC EUROPE

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show abstract

Degradation of signal integrity due to package-common-mode resonance caused by external conductive noise in power supply system

Matsushima

Asai

Nishimoto

et al. 2012

2012 Asia-Pacific Symposium on Electromagnetic Compatibility

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Package-common-mode resonance which is caused by a parasitic capacitance and a parasitic inductance between package and PCB grounds degrades signal and power integrity.A parasitic capacitance between a package ground and a PCB ground resonates with a parasitic inductance at ground connec tions, such as solder balls in a BGA package. In this paper, the authors simulate ground bounce due to the package-common mode resonance caused by external conductive noise in a power supply system. The ground bounce degrades signal integrity of CMOS output signal. The authors demonstrated an increase in jitter of CMOS output at the package-common-mode resonance frequency.

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Linear Dropout Regulator based power distribution design under worst loading

Shayan

Cheng

et al. 2011

2011 9th IEEE International Conference on ASIC

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Resonance-aware methodology for system level power distribution network co-design

Cited by 3 publications

References 3 publications

Experimental verification of signal integrity deterioration due to package-common-mode resonance

Experimental verification of signal integrity deterioration due to package-common-mode resonance

Degradation of signal integrity due to package-common-mode resonance caused by external conductive noise in power supply system

Linear Dropout Regulator based power distribution design under worst loading

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