2008
DOI: 10.1109/pvsc.2008.4922742
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Resonance Ultrasonic Vibrations for in-line crack detection in silicon wafers and solar cells

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Cited by 10 publications
(9 citation statements)
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“…The deviation from the peak and the broadening or narrowing of bandwidth of the spectrum indicates defects in the wafer. This is illustrated in Figure 16, as reported by Monastyrskyi et al (2008) for two identical 125-mm sized Czochralski silicon wafers. Specifically, the crack in the wafer shows the following features: 1) a frequency shift of the peak position; 2) an increase of the bandwidth; and 3) a reduction of the amplitude.…”
Section: Micro-crack Inspection In Solar Wafers/cellssupporting
confidence: 55%
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“…The deviation from the peak and the broadening or narrowing of bandwidth of the spectrum indicates defects in the wafer. This is illustrated in Figure 16, as reported by Monastyrskyi et al (2008) for two identical 125-mm sized Czochralski silicon wafers. Specifically, the crack in the wafer shows the following features: 1) a frequency shift of the peak position; 2) an increase of the bandwidth; and 3) a reduction of the amplitude.…”
Section: Micro-crack Inspection In Solar Wafers/cellssupporting
confidence: 55%
“…The most common methods that have been investigated include laser beam induced current (LBIC) (Carstensen et al, 2003; Sites and Nagle, 2005; Vorster and Dyk, 2007; Zook, 1980), electron beam induced current (EBIC) (Brietenstein et al, 2008; Kittler et al, 1999; Meng et al, 2010), optical testing such as photoluminescence (PL) (Giesecke et al, 2011; Trupke et al, 2006a, 2006b), electroluminescence imaging (Fuyuki and Kitiyanan, 2009), radiometric pulse or thermal imaging (Dunlop and Halton, 2004), and Hyper spectral imaging (Li et al, 2010). Meanwhile other promising techniques such as ultrasonic vibration (Belyaev et al, 2006; Dallas et al, 2007; Monastyrskyi et al, 2008), electrical characterization (Konovalov et al, 1997), and infrared lock in ultrasound thermography (Rakotoniaina et al, 2004) will also be discussed. In this paper, all the aforementioned methods will be reviewed, highlighting some of their salient characteristics including merits and demerits.…”
Section: Micro-crack Inspection In Solar Wafers/cellsmentioning
confidence: 99%
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“…In order to detect cracks and micro-cracks (u-cracks) in cells, a technique based on the analysis of the ultrasonic vibrations that follow an excitation can be used (Dallas et al, 2007;Monastyrskyi et al, 2008). This technique detects deviations in the characteristic frequency of the response after an ultrasonic excitation of the wafer.…”
Section: Resonance Ultrasonic Vibrations (Kuv) Techniquementioning
confidence: 99%
“…3. It is illustrative to show here that other imaging techniques based on photo-or electroluminescence in some cases give false positive results with regards to cracks [8]. The reason is that different surface features such as scratches may be easily identified as cracks with the imaging software.…”
Section: Case Study Amentioning
confidence: 88%