Abstract:Thermoelastic stress analysis (TSA) is an established active thermographic approach which uses the thermoelastic effect to correlate the temperature change that occurs as a material is subjected to elastic cyclic loading to the sum of the principal stresses on the surface of the component. Digital image correlation (DIC) tracks features on the surface of a material to establish a displacement field of a component subjected to load, which can then be used to calculate the strain field. The application of both D… Show more
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