Cu-Sn alloy foams were produced by electrodeposition in a 0.5 M sulfuric acid solution using a porous polyurethane (PU) template. A thin seed layer of Ti/Ni was sputter-deposited on the PU template. The sulfuric acid solution contained 10 mM Cu and 1 mM Sn to electrodeposit Cu-Sn alloy under diffusion-controlled condition. The effect of the solution temperature on the chemical composition, microstructure, and electrical resistivity of Cu-Sn alloy foams was fundamentally investigated. Increasing the solution temperature has reduced cathodic overpotential for alloy reduction, resulting in improved reduction rate and deposition efficiency of Cu-Sn alloy. Thermal treatment for the removal of the PU template contributed to the microstructural recovery of as-electrodeposited Cu-Sn alloy. Electrical resistivity of Cu-Sn alloy foams was measured using a Ag-wired plastic holder. In recent years, a number of researches on the synthesis of metal foams have been performed particularly due to their outstanding properties such as high energy absorption capacity, large specific surface area, and low density. Alloy foams have also attracted more interest because pure metal foams have relatively weak mechanical strength. Open-cell Cu alloy foams are characterized by highly porous structure, moderate mechanical properties, and excellent thermal and electrical conductivities in comparison to pure Cu foam for industrial applications. For example, Cu alloy foams have been studied for electrodes of Li-ion batteries to prepare for the increased demand for rechargeable batteries of high performance and large capacity as there is the explosive rise in popularity of portable electronic devices and electric vehicles.12,13 Cu-Sn alloy foams were suggested especially for a component of Li-ion battery electrodes considering their high specific gravimetric capacity, large volume capacity, cycleability, and low cost. [14][15][16] However, fundamental researches on the synthesis method of CuSn alloy foams were not carried out sufficiently although some processes such as ball milling, sintering, and electrodeposition were previously proposed to prepare Cu-Sn alloy foams. [17][18][19] Preparation of open-cell Cu-Sn alloy foams by electrodeposition is more appropriate in respect that an electrolyte can be delivered through their open-cell structures with micro-pores. The control of the chemical composition, microstructure, and electrical property of Cu-Sn alloy foams is available by understanding process parameters in producing Cu-Sn alloy foams by electrodeposition. The parameters include the chemical composition, pH, temperature, and stirring rate of an electrolyte as well as applied current and potential.In this study, we propose an electrochemical deposition process in producing Cu-Sn alloy foams using a porous polyurethane (PU) template. The PU foam template was thermally decomposed after a Cu-Sn alloy layer was electrodeposited on its surface covered with a thin Ti/Ni seed layer. Low concentrations of Cu and Sn, and a large Cu/Sn molar ratio...