2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA) 2017
DOI: 10.1109/wipda.2017.8170568
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Response surface modeling for parasitic extraction for multi-objective optimization of multi-chip power modules (MCPMs)

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Cited by 11 publications
(2 citation statements)
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“…5(b). The response surface model described in [17] is then used to evaluate the self-parasitic values of every edge. The mutual inductance between every two edges can be evaluated using equations in [11].…”
Section: Methodsmentioning
confidence: 99%
“…5(b). The response surface model described in [17] is then used to evaluate the self-parasitic values of every edge. The mutual inductance between every two edges can be evaluated using equations in [11].…”
Section: Methodsmentioning
confidence: 99%
“…However, the above-mentioned methods tend to be computationally costly when multiple consecutive inductance extractions are to be performed, what limits their usability for layout optimization. For optimization where the computational time of the parasitic inductance extraction is a crucial factor, more commonly used methods are to utilize lumped element circuit methodologies, such as with analytical microstrip equations available in PowerSynth [1] with some accuracy loss, or crude mesh analysis present in FastHenry [2]. Recent developments brought FFT-accelerated partial element equivalent circuit (PEEC) [3] and volume integral equation (VIE) [4] methods, achieving a significant reduction in computation time while maintaining good accuracy.…”
Section: Introductionmentioning
confidence: 99%