matrix, [4,5] the interface between the matrix and the filler, [6,7] and particularly by the filler properties, including the orientation, agglomeration state, and network state. [8][9][10][11][12] The thermal conductivity of polymer composites can be increased by changing the orientation and aggregation state of the filler material to increase the length of the mean free path of phonons. [13,14] In addition, the formation of a percolation network, which facilitates long-range connectivity in a random system of fillers, is crucial for lengthening the mean free path of phonons. Therefore, the efficient percolation of filler materials and improvement of filler dispersibility are actively being studied to increase the thermal conductivity of composites. [15,16] The aggregation materials are classified into H-and J-type aggregates according to the way in which the molecules assemble under external pressure. [17][18][19] H-type aggregates correspond to materials in which molecules are vertically packed. As the pressure increases, the vertical distance between molecules decreases. In the J-type aggregate, molecules are horizontally packed. As a result, as the pressure increases, the vertical distance between molecules decreases. [20][21][22][23][24] Tetraphenylethylenes (TPEs) are representative fluorescent filler materials that form two different aggregation states depending on the molecular structure under pressure. [25,26] Furthermore, TPEs are typical fluorescent fillers that demonstrate aggregation-induced emission (AIE) because their intramolecular motions are inhibited under pressure. [27,28] Therefore, as the external pressure increases, the maximal fluorescence emission wavelength (λ max ) blueshifts when the TPE derivatives form H-type aggregates, whereas it redshifts when the TPE derivatives form J-type aggregates. [22,[29][30][31][32][33] The available methods for achieving high heat dissipation by encapsulating electronic components in epoxy molding compounds (EMCs) are improving steadily, which enables packaging semiconductors to prevent damage and efficiently remove internally generated heat. [34,35] EMC components are molded via transfer or injection molding processes, wherein the epoxy (EP) is exposed to high temperatures and pressures. Controlling the aggregation state to efficiently form heat transfer paths using appropriate pressures during the EMC molding process is expected to facilitate the development of EMC materials with increased thermal conductivities. Therefore, in thisThe dependence of thermal conductivity on molding pressure in composites containing H-and J-type aggregation molecules is investigated for the first time. When mixed with hexagonal boron nitride (h-BN), small molecules capable of H-and J-aggregation significantly affect the orientation of h-BN under pressure, resulting in a substantial pressure dependence. For demonstration, 4′,4′′′-(1,2-diphenylethylene-1,2-diyl)bis{(1,1′-biphenyl)-4-carbonitrile} (TPE-2CP) and 4′,4′′′,4′′′′′,4′′′′′′′-(ethene-1,1,2,2-tetrayl)tetrakis[{(1,1′-...