Results of Sn/Pb solder affected aluminum under wear study

Abstract

Nanostructured Al-Sn and Al-Pb alloys are effectively used to improve their wear characteristics. Taking this into consideration, the wear properties of aluminum have been studied while affected by both elements Sn-Pb solder at a lower level to explore its reusing potentials. In this purpose a common pin-on-disk device is used in which different dry, wet and corrosive sliding environments are applied. Additionally, pure Al, Al-Sn and Al-Pb alloys are also considered for recovering the clarification and to separate elemental effects on wear properties. The worn surfaces of the samples are examined using optical and scanning electron microscopy, both before and after wear. Surface roughness also is a measure to assess the wear properties under different environments. The findings revealed that minor solder has a great impact on the wear properties of Al with Sn playing a better role than Pb. Solid solution strengthening is the main reason for improved wear behavior in terms of the low wear rate and coefficient of friction. Both Sn and Pb do not form any intermetallic with Al but with impurities it can easily occur particularly with Sn resulting in better wear properties. This phenomenon is more prominent in corrosive environment than wet due to the protective oxide layer on the surfaces. In dry sliding conditions, numerous large wear particles, oxide debris and grooves can be seen on the worn surface, but smoother wear tracks are seen in wet and corrosive environments as form oxide film and thumbs down somewhat direct contact on the moveable surfaces. SEM analysis also reveals higher abrasive wear and plastic deformation on the worn surface produced under dry sliding conditions where minor added alloys indicating that reinforcing particles effectively influence the properties.