Conference Record of the Twenty-Eighth IEEE Photovoltaic Specialists Conference - 2000 (Cat. No.00CH37036)
DOI: 10.1109/pvsc.2000.915746
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Results to date-development of new EVA-based encapsulants, faster-curing and flame-retardant types

Abstract: This research focuses on development of "fastercuring" and "flame-retardant'' EVA-based encapsulants. Cure kinetics measured by Moving Die Rheometry determined that cure time reductions of -70% were accomplished, achieving full cure (80% or greater gel content), versus commercial "fast-cure'' EVA-based encapsulant. Prototype 60-watt polycrystalline silicon modules were manufactured using 5 and 6 minute lamination cycles in a Spire 240A laminator. The implications of a successful development are significant, as… Show more

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“…The optimum cure times (t C 90) of these curves are 7.93, 6.63 and 4.52 minutes; the CRI are 14.37, 16.85 and 25.74 min -1 , respectively. These results are similar to other reports in literature on fast cure formulation [7,8]. Lupersol TBEC has a low half-life temperature (1 hr halfife at 121˚C).…”
Section: Curing Behavior By Using Peroxyester Peroxidesupporting
confidence: 92%
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“…The optimum cure times (t C 90) of these curves are 7.93, 6.63 and 4.52 minutes; the CRI are 14.37, 16.85 and 25.74 min -1 , respectively. These results are similar to other reports in literature on fast cure formulation [7,8]. Lupersol TBEC has a low half-life temperature (1 hr halfife at 121˚C).…”
Section: Curing Behavior By Using Peroxyester Peroxidesupporting
confidence: 92%
“…Modules fabricated with this cure cycle showed even and complete curing and no bubbles. Galica and Sherman [7] developed faster-curing and flame-retardant EVA-based encapsulant formulations and conducted an improved technique of cure kinetic measurement using a Moving Die Rheometer (MDR), which could reduce cure time determination about 70% of ordinary technique (standard gel content test).…”
Section: Introductionmentioning
confidence: 99%