2000
DOI: 10.1557/proc-638-f5.3.1
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Retardation in the Oxidation Rate of Nanocrystalline Silicon Quantum Dots

Abstract: ABSTRACTÂ Â Â ÂUsing very-high-frequency (VHF) plasma decomposition of SiH 4 and pulsed gas technique, we have successfully prepared nanocrystalline silicon (nc-Si) quantum dots having average diameter of 8 nm and dispersion of 1 nm. The role of natural oxide is very important. It controls the size of nc-Si dots. Of particular interest is that the oxidation of these dots can be self limited, due to the stress induced near Si/oxide interface, which would allow further reduction of size and improvement in disper… Show more

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Cited by 13 publications
(25 citation statements)
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“…The oxidation rate is reduced to 1/3 for Si NC with an initial size of 15 nm compared with that of Si(100) substrate for 15 h oxidation at 750°C. 38 As oxidation is much slower than RTA, oxidation of the as-deposited SiO x films can be regarded as a two-step process, i.e., a RTA process finished in 1 min, and a dominant long-time oxidation subsequently. Thus, oxidation of the as-deposited SiO x films is analogical to oxidation of the annealed SiO x films.…”
Section: F Oxidation Effectsmentioning
confidence: 99%
“…The oxidation rate is reduced to 1/3 for Si NC with an initial size of 15 nm compared with that of Si(100) substrate for 15 h oxidation at 750°C. 38 As oxidation is much slower than RTA, oxidation of the as-deposited SiO x films can be regarded as a two-step process, i.e., a RTA process finished in 1 min, and a dominant long-time oxidation subsequently. Thus, oxidation of the as-deposited SiO x films is analogical to oxidation of the annealed SiO x films.…”
Section: F Oxidation Effectsmentioning
confidence: 99%
“…6,7 This fabrication route is very attractive because of its ability to control the size and location of a narrow NC band and its compatibility with standard complementary metal-oxide semiconductor ͑CMOS͒ processes. In practice, high-dose ͑typically 10 16 cm −2 ͒ Si implantation in the 1 keV range into very thin ͑Ͻ10 nm͒ oxide layers followed by annealing at temperatures in the 900-1000°C range allows for the formation of two-dimensional ͑2D͒ arrays of Si NCs at tunable tunneling distances from the SiO 2 / Si interface. 6 As shown in Ref.…”
Section: Introductionmentioning
confidence: 99%
“…The oxidation rate is reduced to 1/3 for Si nanocrystals with an initial size of 15 nm compared with that of a Si͑100͒ substrate for 15 h oxidation at 750°C. 31 Complete oxidation of Si nanocrystals is difficult and Si nanocrystals are embedded in the oxide layer after oxidation. Oxidation can reduce the size of the nanocrystals ͑give rise to the QCE͒, convert the outer layer material into Si oxide ͑introduce the Si-SiO x interface or defects in the oxide layer͒, and create c-Si in an oxide shell ͑passivate the nanocrystal surface͒.…”
Section: Effects Of Oxidation and Annealingmentioning
confidence: 99%