Revealing substructure in clock-rolled Ta aided with triple focused ion beam

Liu, Shifeng; Hao, Xiao-Bo; Deng, Chao; Fan, Haiyang; Qing, Liu

doi:10.1007/s12598-015-0540-3

Cited by 3 publications

(1 citation statement)

References 22 publications

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“…The texture gradient along the thickness direction of the clock rolling method is lower and the grain size distribution is relatively uniform [15]. Liu et al thought that 135° clock rolling is an effective way to weaken the texture gradient in the thickness direction of the tantalum plate [16]. The clock rolling makes the surface layer of the annealed Ta plate form a weaker α-<110>//ND texture and θ-<100>//ND texture, and the center layer has a relatively strong γ-<111>//ND texture [17].…”

Section: The Influence Of the Rolling Methods On The Uniformity Of Te...mentioning

confidence: 99%

Progress of Microstructure and Texture of High Purity Tantalum Sputtering Target

Bai¹,

Xiong²,

Luo

et al. 2021

MSF

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In recent years, the IC (integrated circuit) industry has developed rapidly and the chip process technology has developed in the direction of higher density. Because of its good chemical stability, tantalum is used as a sputtering coating material for the diffusion barrier in the copper interconnect process. The uniform microstructure of the tantalum target directly affects the sputtering performance. The fabrication of high-quality thin films requires the tantalum target to have fine and uniform crystal grains and random grain orientation distribution. However, due to the characteristics of tantalum, it is easy to form a microstructure with {100} (<100>//ND) orientation on the surface and {111} (<111>//ND) orientation on the core during cold working. During the fabrication of thin films, the sputtering rate varies with the thickness of the target, which affects the sputtering stability. To provide ideas for improving the uniformity of the microstructure of the tantalum target, this article reviews the preparation processes that affect the grain orientation and size of the high-purity tantalum target, including forging methods, rolling methods, recrystallization annealing, etc., analyze the law of texture evolution of tantalum and introduction the research status of cold working and recrystallization.

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Section: The Influence Of the Rolling Methods On The Uniformity Of Te...mentioning

confidence: 99%

Progress of Microstructure and Texture of High Purity Tantalum Sputtering Target

Bai¹,

Xiong²,

Luo

et al. 2021

MSF

View full text Add to dashboard Cite

show abstract

Evolution of microstructure and grain boundaries during annealing of high-purity tantalum materials

Qi,

Wang,

et al. 2024

International Journal of Refractory Metals and Hard Materials

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Finite Element Simulation of Multi-Pass Rolling of a Pure Aluminum Target under Different Rolling Routes and Methods

Qiu,

Xu,

et al. 2024

Metals

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By coordinating the rolling direction and mode, a multi-rolling plastic deformation process for an aluminum (Al) sputter target is proposed to achieve multiple excellent properties, including a uniform and fine grain structure and low defect risk, which are significant in producing high-quality sputtered films. In this work, therefore, DEFORM 3D 10.2 software is adopted to establish three strategies, clock-synchronous rolling, cross-synchronous rolling, and clock–snake rolling. The effect of different rolling routes and modes on the metal flow velocity (MFV), effective strain distribution (ESD), grain size distribution (GSD), damage, and rolling force (RF) are comparatively investigated. The simulation results show that clock–snake rolling can increase the MFV and effective strain by producing a deeper deformation than the others. It provides sufficient energy for dynamic recrystallization to promote grain refinement. In combination with the microstructure homogeneity promoted by the clock rolling route, the GSD from 6.5 to 44.3 μm accounts for about 80.5% of all the grains because of the fact that a randomly oriented grain region is full of high-angle grain boundaries. Compared with the synchronous rolling mode, the decrement in RF maximum reaches up to 51% during the asynchronous rolling process because component energy is consumed to form cross-sheering stress. It remarkably reduces the risk of defects, with a damage value of less than 73%, and simultaneously improves energy efficiency owing to smaller and uniform grains caused by less RF. The results obtained in this work are of great significance as they can guide practical production in the metal target industry.

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Revealing substructure in clock-rolled Ta aided with triple focused ion beam

Cited by 3 publications

References 22 publications

Progress of Microstructure and Texture of High Purity Tantalum Sputtering Target

Progress of Microstructure and Texture of High Purity Tantalum Sputtering Target

Evolution of microstructure and grain boundaries during annealing of high-purity tantalum materials

Finite Element Simulation of Multi-Pass Rolling of a Pure Aluminum Target under Different Rolling Routes and Methods

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