“…[9,10] In the past decades, the thermal rectification phenomenon has been investigated in solid materials with asymmetric structures. [11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27][28][29] In 1936, the thermal rectification phenomenon has been reported in a system with copper/cuprous oxide interface, which is caused by the electron-phonon scattering at the interface. [11] Then, several thermal rectification mechanisms have been proposed, including the thermal potential barrier at the interface, [12] temperature-dependent interfacial thermal resistance or bulk thermal conductivity, [13,14] asymmetric nanostructures, [15] and electron transfer.…”