Review of active thermal and lifetime control techniques for power electronic modules

Andresen, Markus; Liserre, Marco; Buticchi, Giampaolo

doi:10.1109/epe.2014.6910822

Cited by 62 publications

(39 citation statements)

References 44 publications

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“…In order to reduce the thermal cycling without over design or additional hardware, it is of interest to use active thermal control [14] for the improvement of the reliability. In [15]- [17], the switching frequency control method was presented, which manipulates the switching frequency depending on a power variation in order to reduce the thermal cycling.…”

Section: Thermally Compensated Discontinuous Modulation Strategy Formentioning

confidence: 99%

Thermally Compensated Discontinuous Modulation Strategy for Cascaded H-Bridge Converters

Andresen

Buticchi

2018

IEEE Trans. Power Electron.

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Abstract-A widely adopted multilevel converter topology is the cascaded H-bridge (CHB), as it can provide voltage and power scalability. However, since the CHB converter can be composed by cells with different remaining lifetime, it could be useful to delay a fault of higher aged cells in order to prolong the entire converter's lifetime. In this paper, a thermally compensated discontinuous pulse width modulation (DPWM) strategy is proposed in order to reduce the thermal stress for power semiconductors in power modules of higher aged cells. Considering the thermal cycles as the most influencing cause of wear out of power modules, the proposed method compensates the thermal cycles under a varying power profile by manipulating the clamping angle of the DPWM. Moreover, the proposed method obtains a comparable total harmonic distortion performance to the phase-shifted carrier modulation.Index Terms-Active thermal control, cascaded H-bridge (CHB), discontinuous pulse width modulation (DPWM), multilevel converter, reliability.

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Section: Thermally Compensated Discontinuous Modulation Strategy Formentioning

confidence: 99%

Thermally Compensated Discontinuous Modulation Strategy for Cascaded H-Bridge Converters

Andresen

Buticchi

2018

IEEE Trans. Power Electron.

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“…Several other topologies have since then been suggested in order to further improve on the standard halfbridge MMC topology, such as reduced stack volume [4], [5] or DC fault blocking capability [6], [7]. A notable aspect common to all these new converter topologies consists in the fact that most of these gains on the electrical side have been made available mainly thanks to the extensive (yet complex) controllability [8]- [12] of the stacks of SM.…”

Section: Introductionmentioning

confidence: 99%

Active power losses distribution methods for the modular multilevel converter

Merlin

Mitcheson

2016

2016 IEEE 17th Workshop on Control and Modeling for Power Electronics (COMPEL)

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“…Another solution, to reduce the overrating, is the industrially invented concept of active thermal control [15]. During conditions with high torque and low speed, the converter is reducing the switching frequency and regulating the output current for preventing excessive thermal cycling [16].…”

Section: B Junction Temperature Impact In Electric Drivesmentioning

confidence: 99%

Thermal-based finite control set model predictive control for IGBT power electronic converters

Falck

Andresen

Liserre

2016

2016 IEEE Energy Conversion Congress and Exposition (ECCE)

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Abstract-Thermal cycling is one of the main sources of aging and failure in power electronics. A possibility to reduce the thermal stress of semiconductors is to control the losses occurring in the semiconductor devices with the target to reduce the thermal cycles. This approach is known as active thermal control. The hardest limit of the existing active thermal control approaches is that they do not offer a general framework where the optimal switching sequence is selected in order to fulfill the applications demand and reduce the thermal stress in specific semiconductors. The goal is to achieve the minimum thermal stress for the best possible overall performance. For this purpose finite control-set model predictive control (FCS-MPC) seems the optimal approach because it allows including of non-linear thermal and lifetime related models into the control law. A precise control of the thermal stress in the semiconductors can be achieved as the optimal switching vector is directly applied to the physical system. This allows to avoid overrating of the used module or to increase its lifetime. In the paper the approach is proven using simulation and experimental results.

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Review of active thermal and lifetime control techniques for power electronic modules

Cited by 62 publications

References 44 publications

Thermally Compensated Discontinuous Modulation Strategy for Cascaded H-Bridge Converters

Thermally Compensated Discontinuous Modulation Strategy for Cascaded H-Bridge Converters

Active power losses distribution methods for the modular multilevel converter

Thermal-based finite control set model predictive control for IGBT power electronic converters

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