Review of board-level solder joint reliability under environmental stress

Role of alternating current shape on microstructure and damage evolution of solder joints

“…In fact, the integration of electronic modules comes at the expense of accelerated damage evolution in their vulnerable electronic parts, especially solder joints [5][6][7]. Thermal cycling, vibrational frequencies, electric current effects and harsh environmental situations are factors influencing reliability of solder joints [8][9][10][11][12][13]. Among them, the electric current with different failure mechanisms plays a significant role on the solder degradation.…”

Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies

“…Finite element modeling is a powerful tool for calculation of the effects of vibration loading on the mechanical reliability of electronic devices, especially with ball solder joints to test the configuration of the system and forecast the probable failure of the package because of inaccessibility to stress history in random vibration loading (Liu et al, 2015). Some approaches have been accordingly suggested for investigation of electronic packages under random vibration loads and mechanical shocks (Ghaderi et al, 2018;Tsai et al, 2007;Gadalla et al, 2015;Fang et al, 2016). Along with finite element method (FEM) simulations, some experimental tests have been performed to discuss the mechanical fatigue lifetime of electronic packages.…”

Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements

“…Electronic equipment for aerospace and military applications can encounter a wide range of environmental stresses mainly due to thermomechanical loadings (temperature variations) eventually leading to solder joints cracking [1]. With the RoHS directive preventing the use of lead (Pb), lead-free solder joint fatigue in severe temperature environments has been widely studied among the electronic industry and academics [2]. Several fatigue models based on different fatigue criteria have therefore been developed over the years to assess solder joints durability under thermal cycling conditions [3].…”

“…Another way to assess this damage metric and capture continuous viscoplastic effects during thermal cycles is the construction of the experimental solder joints shear stress-strain hysteresis curve Corresponding author. 2 Hall's One-Dimensional model 2.1 Axial Symmetry Assumptions. In his original paper, Hall considered an axial symmetry to simplify the complex strain field generated during thermal cycling in an electronic assembly.…”

“…Combining Eqs. (2) and 3, which give the expressions of the radii of curvature according to the measured strains, with Eqs. (5)- (8), the shear stress can be expressed as a function of known and measurable variables…”