Review of Compound Materials Bonding and Layer Transfer for Optoelectronic Applications

Abstract

Wafer bonding and layer transfer technologies open new ways for substrate and device structures in a wide field of application. This paper will review major achievements over the last ten years in building innovative structures in III-V materials by bonding and layer transfer by means of the Smart Cutä technology. Main published results about GaAs, InP, SiC and GaN layer transfer will be presented here.