2016
DOI: 10.15269/jksoeh.2016.26.1.1
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Review of Hazardous Agent Level in Wafer Fabrication Operation Focusing on Exposure to Chemicals and Radiation

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“…The weight of the wafer increases along with its diameter, which makes manual handling of wafers difficult. To overcome this issue, many processes have become automated and older processes, chemicals, and operational methods that had been used to produce smaller wafers are being phased out [ 28 , 29 ]. Therefore, differences in occupational exposure based on the semiconductor production period must be considered.…”
Section: Discussionmentioning
confidence: 99%
“…The weight of the wafer increases along with its diameter, which makes manual handling of wafers difficult. To overcome this issue, many processes have become automated and older processes, chemicals, and operational methods that had been used to produce smaller wafers are being phased out [ 28 , 29 ]. Therefore, differences in occupational exposure based on the semiconductor production period must be considered.…”
Section: Discussionmentioning
confidence: 99%