Review of Heat Transfer Technologies in Electronic Equipment

Abstract

Thermal control has become a critical factor in the design of electronic equipment because of the recent trends in the electronic industry towards increased miniaturization of components and device heat dissipation. A great demand on the system performance and reliability also intensifies the needs for a better thermal management. The further evidence of importance of thermal consideration to an electronic system is due to the survey by the U.S. Air Force indicating that more than fifty percent of all electronics failures are caused by the undesirable temperature control. This paper reviews recent technologies in thermal control and management of electronic equipment.

Internal natural convection driven by an orthogonal pair of differentially heated plates

“…Cooling of electronic equipment packages by means of natural convection has been accepted as a viable alternative to forced cooling in some circumstances [1][2][3]. The optimal thermal design of electronic devices depends on an accurate choice of not only geometrical configuration but also heat source distribution to promote thermo-circulation flow rate that minimizes the rise in temperature.…”

Three‐dimensional lattice Boltzmann BGK model and its application to flows with heat transfer in a rectangular microchannel

“…The rapid development of micro electromechanical systems (MEMS) has resulted in an increasing demand for highly e cient electronic cooling technologies [1,2]. To meet this demand, a deep understanding of the ow and heat transfer in micro scale is important.…”

An optimal parametric design to improve chip cooling

“…For instance, the reliability of a silicon chip declines about 10% for every 2°C rise in temperature [1]. Yeh [2] pointed out that over 50% of electronic failures are temperature-related in a US Air Force study. Accordingly, lots of researches have been conducted into improving the thermal design of electronic devices.…”