Review of High-Temperature Power Electronics Converters

Xiao, Yudi; Zhang, Zhe; Duraij, Martijn; Zsurzsan, Gabriel; Andersen, Michael A. E.

doi:10.1109/tpel.2022.3148192

Cited by 18 publications

(8 citation statements)

References 80 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…It is noted that while working in reality, the efficiency might be higher. All the conduction losses in the table are calculated at 25 • C, but due to the fact that the working temperature of IGBT will rise to around 85 • C [46], the conduction losses will be significantly reduced, thereby improving the overall efficiency.…”

Section: Discussionmentioning

confidence: 99%

Robust fault‐tolerant design for LC‐coupling hybrid active power filter

Yuan,

Lei,

Kai

et al. 2023

IET Power Electronics

View full text Add to dashboard Cite

In this paper, an open‐circuit fault‐tolerant topology of LC‐coupling hybrid active power filter (LC‐HAPF) and its control strategy are proposed at the switch level, which can greatly improve the reliability of the system. The proposed structure has a contactor between the midpoint of each bridge arm and the negative bus of the dc‐link capacitor. When a single‐phase fault occurs, the proposed LC‐HAPF can be reconstructed into a three‐phase four‐switch system to compensate for the harmonic and reactive power, while the power quality compensation effect is hardly affected. When a two‐phase fault occurs, the operation of the normal bridge arm is not affected, and the two faulty bridge arms can suppress harmonic current and compensate for a fixed reactive power through the passive filters. When the bridge arms all fail, the whole device acts as a passive filter to suppress the harmonic current of the load and to compensate for reactive power as well. Finally, the effectiveness of the proposed topology and its control strategy is verified by simulation and experiment results.

show abstract

Section: Discussionmentioning

confidence: 99%

Robust fault‐tolerant design for LC‐coupling hybrid active power filter

Yuan,

Lei,

Kai

et al. 2023

IET Power Electronics

View full text Add to dashboard Cite

show abstract

“…Temperature variations: The ambient temperature and device operational temperature vary over time, which affects the FPGA logic fabric performance [ 39 , 44 , 45 ]; therefore, it is crucial to study the impact of temperature variation on the performance of FPGA-based TDCs.…”

Section: Methodsmentioning

confidence: 99%

A Study on the Effect of Temperature Variations on FPGA-Based Multi-Channel Time-to-Digital Converters

Alshehry,

Alshahry,

Alhazmi

et al. 2023

Sensors

View full text Add to dashboard Cite

We describe a study on the effect of temperature variations on multi-channel time-to-digital converters (TDCs). The objective is to study the impact of ambient thermal variations on the performance of field-programmable gate array (FPGA)-based tapped delay line (TDL) TDC systems while simultaneously meeting the requirements of high-precision time measurement, low-cost implementation, small size, and low power consumption. For our study, we chose two devices, Artix-7 and ProASIC3L, manufactured by Xilinx and Microsemi, respectively. The radiation-tolerant ProASIC3L device offers better stability in terms of thermal sensitivity and power consumption compared to the Artix-7. To assess the performance of the TDCs under varying thermal conditions, a laboratory thermal chamber was utilized to maintain ambient temperatures ranging from −75 to 80 °C. This analysis ensured a comprehensive evaluation of the TDCs’ performance across a wide operational range. By utilizing the Artix-7 and ProASIC3L devices, we achieved root mean square (RMS) resolution of 24.7 and 554.59 picoseconds, respectively. Total on-chip power of 0.968 W was achieved using Artix-7, while 1.997 mW of power consumption was achieved using the ProASIC3L device. We worked to determine the temperature sensitivity for both FPGA devices, which could help in the design and optimization of FPGA-based TDCs for many applications.

show abstract

“…Research has found that the encapsulants used to safeguard the components of (U)WBG power modules from external factors like dust and humidity are a limiting factor in the hightemperature packaging of the modules compared to other components. This highlights the need to prioritize the long-term stability of encapsulants to ensure reliable packaging [73], [84]. Currently, SG and epoxy resin (EP) are the most commonly used encapsulants for packaging (U)WBG power modules.…”

Section: B Alternative Encapsulation Materials In Place Of Silicone Gelmentioning

confidence: 99%

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges Within High-Voltage, High-Power-Density (U)WBG Power Module Packages

Adhikari,

Ghassemi

2024

IEEE Trans. Dielect. Electr. Insul.

View full text Add to dashboard Cite

Within the expanding domain of electrical power demand, the future of power module packaging is entwined with the progress of (ultra) wide bandgap (UWBG) materials. These materials, like silicon carbide (SiC), aluminum nitride (AlN), and diamond, offer advantages with higher power density, decreased weight, and expanded operational abilities regarding temperature, voltage, and frequency. However, the pursuit of pushing these limits confronts challenges within insulation systems, which may struggle to endure the demands of these parameters, potentially resulting in unfavorable conditions like high electric field, space charge accumulation, electrical treeing, and partial discharge (PD), leading to insulation failure. The emphasis of this paper is to review the insulation challenges within (U)WBG power modules and recent research in mitigating the electric field stress at triple points (TPs) and resolving the PD issues. The manuscript first discusses the high electric field stress issue at triple points. Then, ceramic substrate materials, encapsulation materials, and the influence of harsh weather conditions on them are reviewed. The space charge, electrical treeing, and PD issues within encapsulation materials are analyzed under practical operation conditions of (U)WBG power modules like high frequency, temperature, and square wave pulses. Finally, the various strategies to alleviate the associated insulation challenges are meticulously discussed. While the identified mitigation strategies are able to strengthen insulation systems for packaging, their validation under actual operational conditions of (U)WBG power modules remains relatively unexplored, representing a potential avenue for further investigation. This review offers a valuable framework by providing the constraints of the current studies and recommendations for the future that can be utilized as a reference point for future research endeavors. Index Terms-(U)WBG power module packaging, partial discharge, triple points, encapsulation material, electric field stress, high power density, field grading materials, nonlinear field-dependent conductivity layerThis paragraph of the first footnote will contain the date on which you submitted your paper for review, which is populated by IEEE.

show abstract

Review of High-Temperature Power Electronics Converters

Cited by 18 publications

References 80 publications

Robust fault‐tolerant design for LC‐coupling hybrid active power filter

Robust fault‐tolerant design for LC‐coupling hybrid active power filter

A Study on the Effect of Temperature Variations on FPGA-Based Multi-Channel Time-to-Digital Converters

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges Within High-Voltage, High-Power-Density (U)WBG Power Module Packages

Contact Info

Product

Resources

About