2016
DOI: 10.1515/freq-2016-0119
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Review of Millimeter-Wave Integrated Circuits With Low Power Consumption for High Speed Wireless Communications

Abstract: In this paper we review high-speed radiofrequency integrated circuits operating up to 210 GHz and present selected state-of-the-art circuits with leading-edge performance, which we have designed at our chair. The following components are discussed employing bipolar complementary metal oxide semiconductors (BiCMOS) technologies: a 200 GHz amplifier with 17 dB gain and around 9 dB noise figure consuming only 18 mW, a 200 GHz down mixer with 5.5 dB conversion gain and 40 mW power consumption, a 190 GHz receiver w… Show more

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Cited by 4 publications
(2 citation statements)
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“…This advantage comes from the improvement of the received signal by the gain factor of the mixer and IF amplifier components, enabling the detection of weak signals. Moreover, the signal can also be boosted by a low noise amplifier before it is downconverted into an IF signal in the case of FET-based heterodyne imager at sub-THz applications [26]. However, additional noise contribution from the nonlinear components has a drawback in limited noise performance reduction compared with responsivity improvement capability.…”
Section: A Measurement Methodsmentioning
confidence: 99%
“…This advantage comes from the improvement of the received signal by the gain factor of the mixer and IF amplifier components, enabling the detection of weak signals. Moreover, the signal can also be boosted by a low noise amplifier before it is downconverted into an IF signal in the case of FET-based heterodyne imager at sub-THz applications [26]. However, additional noise contribution from the nonlinear components has a drawback in limited noise performance reduction compared with responsivity improvement capability.…”
Section: A Measurement Methodsmentioning
confidence: 99%
“…In order to achieve high-speed data transfer, the frequency of digital signals has been increased. 1) , 2) In general, an electronic device is manufactured by assembling electronic components such as capacitors and diodes on a printed circuit board (PCB) , which involves printing a metal wiring pattern on a resin material. 3) -7) When an alternating current flows in a metal wiring pattern on a PCB, energy is lost and heat is generated.…”
Section: Introductionmentioning
confidence: 99%