Wire arc additive manufacturing (WAAM) is an efficient technique for producing medium to large‐size components, due to its accessibility and sustainability in fabricating large‐scale parts with high deposition rates, employing low‐cost and simple equipment, and achieving high material efficiency. Consequently, WAAM has garnered attention across various industrial sectors and experienced significant growth, particularly over the last decade, as it addresses and mitigates challenges within production markets. One of the primary limitations of WAAM is its thermal history during the process, which directly influences grain formation and microstructure heterogeneity in the resulting part. Understanding the thermal cycle of the WAAM process is thus crucial for process improvement. Typically, fabricating a part using WAAM results in a microstructure with three distinct zones along the build direction: an upper zone (thin surface layer) with fine grains, a middle zone dominated by undesirably long and large columnar grains covering more than 90% of the produced part, and a lower zone with smaller to intermediate columnar grains closer to the substrate material. These zones arise from variations in cooling rates, with the middle zone exhibiting the lowest cooling rate due to 2D conduction heat transfer. Consequently, producing a component with a microstructure comprising three different zones, with a high fraction of large and long columnar grains, significantly impacts the final mechanical properties. Therefore, controlling the size and formation of these grain zones plays a key role in improving WAAM. The aim of this work is to investigate the formation of undesired columnar grains in austenitic stainless steel 316L during WAAM and propose a simple hybrid technique by combining WAAM with a hot forging process (with or without interlayer cooling time). This approach targets the disruption of the solidification pattern of columnar grain growth during deposition progression and aims to enhance the microstructure of WAAM components.