Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
DOI: 10.1007/0-387-32989-7_34
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Review of the Technology and Reliability Issues Arising as Optical Interconnects Migrate onto the Circuit Board

P. Misselbrook
1
,
D. Gwyer
2
,
Christopher Bailey
3
et al.
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