2016 IEEE Region 10 Conference (TENCON) 2016
DOI: 10.1109/tencon.2016.7848445
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Review on application of additive manufacturing for electrical power converters

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Cited by 7 publications
(5 citation statements)
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“…0 E C 0 signifies the critical energy for the photopolymerization process and 0 D P 0 represents the penetration depth at which 1=e of exposure energy (E) is reached during the curing process. It can be shown in Equation (3), that the radiation intensity (I) of a UV beam is directly proportional to time (t c ) when the UV beam is constantly illuminated from the source.…”
Section: Tailoring the Curing Behavior Of Suspensionsmentioning
confidence: 99%
See 2 more Smart Citations
“…0 E C 0 signifies the critical energy for the photopolymerization process and 0 D P 0 represents the penetration depth at which 1=e of exposure energy (E) is reached during the curing process. It can be shown in Equation (3), that the radiation intensity (I) of a UV beam is directly proportional to time (t c ) when the UV beam is constantly illuminated from the source.…”
Section: Tailoring the Curing Behavior Of Suspensionsmentioning
confidence: 99%
“…AM allows for the creation of complex geometries with high accuracy and resolution, 1 which is essential for producing polymer composites with desired properties. The addition of reinforcing fillers to polymers can enhance their mechanical, thermal, and electrical properties, making them suitable for aerospace, biomedical, and electrical industries 2–4 . However, the successful implementation of polymer composites in AM requires careful consideration of the materials' compatibility, process parameters, and post‐processing treatments.…”
Section: Introductionmentioning
confidence: 99%
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“…In previous publications, such as [8] and [9], reviews of AM technologies for power electronics were conducted. Nevertheless, many meaningful studies on or potentially could be applied to power converters using AM are still missed.…”
Section: Rpmentioning
confidence: 99%
“…However, their focus was on the application of a single method of AM, powder bed fusion. Muthu et al [15] reviewed similar technologies and AM methods, but there have been recent advancements in areas such as composite manufacturing, packaging and TM applications. Lastly, Espera Jr. et al [16] provides a detailed review on the application of various AM for electronics, including passive component and printed circuit board manufacturing.…”
Section: Introductionmentioning
confidence: 99%