Review on silver wire bonding

Lu, Charlie

doi:10.1109/impact.2013.6706647

Cited by 12 publications

(8 citation statements)

References 12 publications

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“…But the use of Cu bonding wire also has some drawbacks, mainly due to its hardness and susceptibility of Cu-Al IMCs to corrosion. Ag bonding wire, as a potential alternative wire, has better electrical and thermal conductivity than Au and Cu bonding wires as well as a relatively moderate price [ 125 ], and has been successfully bonded in die-to-die, overhanging die, DRAM stacked die [ 126 ], and multi die serial bonding in light emitting diodes (LEDs) [ 127 ].…”

Section: Cu Bonding Wirementioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical stability, reliable manufacturing, and operation properties. However, the drastic increasing price of Au bonding wire has motivated the industry to search for alternate bonding materials for use in microelectronic packaging such as Cu and Ag bonding wires. The main benefits of using Cu bonding wire over Au bonding wire are lower material cost, higher electrical and thermal conductivity that enables smaller diameter Cu bonding wire to carry identical current as an Au bonding wire without overheating, and lower reaction rates between Cu and Al that serve to improve the reliability performance in long periods of high temperature storage conditions. However, the high hardness, easy oxidation, and complex bonding process of Cu bonding wire make it not the best alternative for Au bonding wire. Therefore, Ag bonding wire as a new alternative with potential application comes to the packaging market; it has higher thermal conductivity and lower electric resistivity in comparison with Cu bonding wire, which makes it a good candidate for power electronics, and higher elastic modulus and hardness than Au bonding wire, but lower than Cu bonding wire, which makes it easier to bond. This paper begins with a brief introduction about the developing history of bonding wires. Next, manufacturability and reliability of Au, Cu, and Ag bonding wires are introduced. Furthermore, general comparisons on basic performance and applications between the three types of bonding wires are discussed. In the end, developing trends of bonding wire are provided. Hopefully, this review can be regarded as a useful complement to other reviews on wire bonding technology and applications.

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Section: Cu Bonding Wirementioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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“…Silver alloy wire bonds have also been investigated for high temperature operation [149]. Its high thermal conductivity is also beneficial in IMD applications [150]. Flip chip technology can also potentially replace standard interconnections by connecting the power devices directly to the package through conductive metallic bumps [151].…”

Section: Interconnectsmentioning

confidence: 99%

Integrated motor drives: state of the art and future trends

2017

IET Electric Power Applications

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With increased need for high power density, high efficiency and high temperature capabilities in aerospace and automotive applications, integrated motor drives (IMD) offers a potential solution. However, close physical integration of the converter and the machine may also lead to an increase in components temperature. This requires careful mechanical, structural and thermal analysis; and design of the IMD system. This study reviews existing IMD technologies and their thermal effects on the IMD system. The effects of the power electronics position on the IMD system and its respective thermal management concepts are also investigated. The challenges faced in designing and manufacturing of an IMD along with the mechanical and structural impacts of close physical integration is also discussed and potential solutions are provided. Potential converter topologies for an IMD like the matrix converter, two-level bridge, three-level neutral point clamped and multiphase full bridge converters are also reviewed. Wide band gap devices like silicon carbide and gallium nitride and their packaging in power modules for IMDs are also discussed. Power modules components and packaging technologies are also presented. IntroductionOver the last two decades there has been a shift from traditional physically separated motor and drive systems to more compact, power dense, motor-drive combinations [1]. This new power-dense motor-drive structure combines both the motor and its associated control and drive circuitry within a single enclosure. The earliest records of commercially available motor-drive systems were manufactured by Grundfos in 1991 and Franz Morat KG in 1993 [2].These compact systems have been called a variety of names from 'smart motors' to 'integrated motors', the latter forming the foundation for the new moniker currently identified with these systems [3]. The term 'integrated motor drive (IMD)' is the latest associated with this class of products and is as a result of the success of a TB Woods Inc. manufactured motor-drive registered under the same name [3].IMDs are increasingly being developed and produced by machine manufacturers due to the significant potential benefits they offer. The most significant of these benefits include direct replacement of inefficient direct on line motors, increased power density, lower losses and lower costs compared with separate motor and drive solutions. Technological advancements over the last decade have led to the development of robust electronic components able to withstand the harsh environments required by some forms of integration [4]. By eliminating separate enclosures and long cable runs, the integrated approach promises to lower system costs by 20 to 40% [5].Elimination of transmission cables has economic advantages, including increased reliability due to the removal of the output filter commonly required for long cables. Removal of long cable runs and integration into a single package will also significantly reduce potential electromagnetic interference (EMI). This a...

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“…Silver wire bonding is a new interconnecting method in semiconductor Table 1. Basic properties of pure Au, pure Cu and pure Ag [7,11]. However, the drawbacks of pure silver wire are also evident.…”

Section: Introductionmentioning

confidence: 99%

A Review of Silver Wire Bonding Techniques

An,

Zhou,

Cao

et al. 2023

Micromachines

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The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bonding wire currently being studied by researchers, including pure silver wire, alloy silver wire, and coated silver wire, and describes their respective characteristics and development statuses. Secondly, the development of silver-based bonding wire in manufacturing and bonding processes is analyzed, including common silver wire manufacturing processes and their impact on silver wire performance, as well as the impact of bonding parameters on silver wire bonding quality and reliability. Subsequently, the reliability of silver wire bonding is discussed, with a focus on analyzing the effects of corrosion, electromigration, and intermetallic compounds on bonding reliability, including the causes and forms of chlorination and sulfurization, the mechanism and path of electromigration, the formation and evolution of intermetallic compounds, and evaluating their impact on bonding strength and reliability. Finally, the development status of silver wire bonding technology is summarized and future research directions for silver wire are proposed.

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Review on silver wire bonding

Cited by 12 publications

References 12 publications

Research Progress on Bonding Wire for Microelectronic Packaging

Research Progress on Bonding Wire for Microelectronic Packaging

Integrated motor drives: state of the art and future trends

A Review of Silver Wire Bonding Techniques

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