Revolution of next-generation interconnect materials and key processes for advanced chips in post-moore era

Zhang, Simian; Deng, Xiaonan; Wang, Yuqi; Wu, Yifei; Liu, Jianing; Li, Zhengcao; Cai, Jian; Wang, Chen

doi:10.1360/ssc-2023-0146

Sci. Sin.-Chim

2023

DOI: 10.1360/ssc-2023-0146

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Revolution of next-generation interconnect materials and key processes for advanced chips in post-moore era

Simian Zhang,

Xiaonan Deng,

Yuqi Wang

et al.

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Revolution of next-generation interconnect materials and key processes for advanced chips in post-moore era

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References 170 publications

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