RF MEMS switches and switch circuits

Rebeiz, Gabriel M.; Muldavin, Jeremy

doi:10.1109/6668.969936

Cited by 904 publications

(414 citation statements)

References 22 publications

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“…Systems' architectures can be greatly enhanced, in terms of greater performance and functionality and reduced complexity and cost, if switch performance can be improved even further with the use of RF MEMS technology [26,27]. The RF performance of a switch can be represented by the following cut-off frequency figure-of-merit:…”

Section: Switchesmentioning

confidence: 99%

See 1 more Smart Citation

Review of radio frequency microelectromechanical systems technology

Lucyszyn

2004

IEE Proceedings - Science, Measurement and Technology

125

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A review of radio frequency microelectromechanical systems (RF MEMS) technology, from the perspective of its enabling technologies (e.g. fabrication, RF micromachined components and actuation mechanisms) is presented. A unique roadmap is given that shows how enabling technologies, RF MEMS components, RF MEMS circuits and RF microsystems packaging are linked together; leading towards enhanced integrated subsystems. An overview of the associated fabrication technologies is given, in order to distinguish between the two distinct classes of RF microsystems' component technologies; non-MEMS micromachined and true MEMS. An extensive literature survey has been undertaken and key papers have been cited; from these, the motivations behind different RF MEMS technologies are highlighted. The importance of understanding the limitations for realising new and innovative ideas in RF MEMS is discussed. Finally, conclusions are drawn as to where future RF MEMS technology may lead. It is likely that the switch will continue to be the most important RF MEMS component, with future work investigating its enhanced functionality, subsystem integration and volume production. The focus of RF MEMS circuits will shift from the digital phase shifter to high-Q tuneable filters.

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Section: Switchesmentioning

confidence: 99%

“…4, stiction can be a serious problem. For this reason, reliability and hermetic packaging issues are now of the highest priority amongst potential manufacturers [27].…”

Section: Switchesmentioning

confidence: 99%

Review of radio frequency microelectromechanical systems technology

Lucyszyn

2004

IEE Proceedings - Science, Measurement and Technology

125

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“…1 During this process the contact resistance and contact adhesion change, often leading to failto-close or fail-to-open switch failures. In order to study the evolution of microcontacts, we developed a scanning probe microscope ͑SPM͒ based contact test station.…”

mentioning

confidence: 99%

Separation modes in microcontacts identified by the rate dependence of the pull-off force

Chen

McGruer

Adams

et al. 2008

Applied Physics Letters

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We report the observation of two distinct modes of rate-dependent behavior during contact cycling tests. One is a higher pull-off force at low cycling rates and the other is a higher pull-off force at high cycling rates. Subsequent investigation of these contacts using scanning electron microscopy ͑SEM͒ demonstrates that these two rate-dependent modes can be related to brittle and ductile separation modes. The former behavior is indicative of brittle separation, whereas the latter accompanies ductile separation. Thus by monitoring the rate dependence of the pull-off force, the type of separation mode can be identified during cycling without interrupting the test to perform SEM. © 2008 American Institute of Physics. ͓DOI: 10.1063/1.2967855͔Operation of a microelectromechanical system switch requires closing and opening of the microcontacts over many billions of contact cycles. 1 During this process the contact resistance and contact adhesion change, often leading to failto-close or fail-to-open switch failures. In order to study the evolution of microcontacts, we developed a scanning probe microscope ͑SPM͒ based contact test station. 2 Contact testing was performed between hemispherical contact bumps ͑microfabricated on very stiff SPM cantilevers͒ and planar substrates. Both the bumps and substrates were coated with the contact test material. Using this contact tester, we have studied different contact materials 3 and contact adhesion. 4 Microcontacts may separate in brittle or ductile modes. 5 In the brittle mode ͓Fig. 1͑a͔͒, rupture occurs abruptly with little, if any, plastic deformation. In the ductile mode ͓Fig. 1͑b͔͒, rupture occurs more gradually with significant plastic deformation. In previous studies, 2-4 the type of separation mode ͑ductile or brittle͒ which occurred could only be identified by scanning electron microscopy ͑SEM͒ observation and not during the cycling test.Depending on the separation mode, the surface morphology of the microcontacts can change, eventually leading to large changes in the pull-off force ͑i.e., the force needed to separate the contacts͒. 4,5 In this paper, we report our observation that the magnitude of the pull-off force depends on the cycling rate, and that this rate dependence is related to the separation mode. This behavior allows the separation mode to be identified during testing without SEM observation. 6 To study the rate dependence of the pull-off force, a 250 nm gold thin film was sputtered on the hemispherical bump ͑15 m radius of curvature͒ of an especially fabricated very stiff test cantilever ͑K Х 10 4 N / m͒ and also on the mating planar substrate. The tests were performed in laboratory air with a relative humidity of 30%-40%. The cycling tests use a small piezoactuator in addition to those in the SPM to achieve a high cycling rate. The pull-off force was measured using the SPM.The pull-off forces at two cycling rates ͑0.5 and 300 Hz͒ were compared by suddenly switching from one frequency to the other. The maximum contact force was controlled at 200 N during...

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“…RF-MEMS suffer from failures during switching due to fracture of membrane due to high stress prone areas if the stress distribution exceeds about 70% of its material's ultimate tensile strength [9], [10]. In this case study all the above said parameters are analysed using multiphysics modeling.…”

Section: Case Study -Ii: Modeling Of Rf-mems Switchmentioning

confidence: 99%

From Theory to Development: Role of Multiphysics Modeling and its Effect on Education in Electronics

Singh¹

2013

ELS

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Abstract-Electronics engineering is a very rapidly growing field, as the time passes the requirement of more advance technologies increase. There are a lot of institutions and universities around the world that provide quality education to different fields of engineering. The courses that electronics engineers study need practical exposure as well to cope up with industrial demands. In this paper, the role of multiphysics modeling and its impact on engineering education is demonstrated. Finite element modeling (FEM) tools are very powerful tools and due to there huge advantages, electronics graduates should study these tools in their course curriculum to know how to tackle various types of physics problems and through examples it is demonstrated that how these tools can help shift from just theory to development process.

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RF MEMS switches and switch circuits

Cited by 904 publications

References 22 publications

Review of radio frequency microelectromechanical systems technology

Review of radio frequency microelectromechanical systems technology

Separation modes in microcontacts identified by the rate dependence of the pull-off force

From Theory to Development: Role of Multiphysics Modeling and its Effect on Education in Electronics

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