RF modeling and optimization of end-launch SMA to trace transition

Zha, Huan; Lu, Diqun; Wang, Wei; Lin, Fujiang

doi:10.1109/eptc.2015.7412280

Cited by 8 publications

(6 citation statements)

References 8 publications

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“…The reference plane cut-out compensation technique, sometimes referred to as compensation using a defected ground structure (DGS), has been a topic of research in multiple papers that cover different case studies, such as individual SMA connector pads, track bends, etc. [ 6 , 7 ]. Individual reference plane cut-outs under the discontinuities can be shaped differently.…”

Section: Motivation and Existing Compensation Methodsmentioning

confidence: 99%

“…The implementation of these techniques not only addresses impedance discrepancies but also significantly improves the performance and efficiency of SMP connectors. There are scientific publications as well as engineering recommendations that provide methods for compensating impedance discontinuities in SMA edge type connectors [ 6 , 19 ]. The best practices involve incorporating cut-outs into ground reference layers, compensating with coplanar structures, and employing pad taper for optimal connector performance.…”

Section: Motivation and Existing Compensation Methodsmentioning

confidence: 99%

“…where R is the series resistance per unit length (Ω/m), L is the series inductance (H/m), G is the shunt conductance ( compensating impedance discontinuities in SMA edge type connectors [6,19]. The best practices involve incorporating cut-outs into ground reference layers, compensating with coplanar structures, and employing pad taper for optimal connector performance.…”

Section: Motivation and Existing Compensation Methodsmentioning

confidence: 99%

“…Additionally, reference plane cutouts are introduced under each segment of the same width. The rule of thumb for the optimal reference plane cut-out width is that it is two times larger than the width of the discontinuity [ 6 ] and the cut-outs can be applied to PCB stackups with different dielectrics [ 14 ]. Figure 2 c is the legend for Figure 2 a,b.…”

Section: Noveltymentioning

confidence: 99%

See 3 more Smart Citations

Applying Characteristic Impedance Compensation Cut-Outs to Full Radio Frequency Chains in Multi-Layer Printed Circuit Board Designs

Barzdenas,

Vasjanov

2024

Sensors

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Modern wireless communication systems are of utmost importance to various sectors such as healthcare, education, the household, and the advancement of emerging technologies like the internet of things, autonomous vehicles, and the enhancement of 5G. Further development and improvement of these systems drives the need for small dimension, high integration and density, and cost-effective electronic devices. Achieving optimal performance in wireless electronic devices involves overcoming engineering challenges related to microstrip line signal integrity. This research addresses the impact of surface mount technology (SMT) component pads on signal integrity, proposing a novel high-frequency microstrip line structure for mitigating impedance discontinuities. The study introduces stepped microstrip lines and explores characteristic impedance compensation techniques. A six-layer printed circuit board (PCB) structure is presented, and the effects of compensation on signal integrity are analyzed using time-domain reflectometry and scattering parameter measurements. The results demonstrate the effectiveness of compensation methods in aligning characteristic impedance with desired values, thereby ensuring improved impedance matching and transmission coefficients. The average over-the-length impedance for the proposed structure with compensation applied was measured to be 52.7 Ω, which is only 1.3 Ω (2.5%) more than that of the reference microstrip. Applying reference plane cut-outs leads to a maximum compensated absolute value of more than 30 Ω to reach the target impedance with a 10% tolerance. This research contributes valuable insights for advancing wireless communication systems and maintaining robustness in high-frequency microstrip transmission lines.

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Section: Motivation and Existing Compensation Methodsmentioning

confidence: 99%

Section: Motivation and Existing Compensation Methodsmentioning

confidence: 99%

Section: Motivation and Existing Compensation Methodsmentioning

confidence: 99%

Section: Noveltymentioning

confidence: 99%

See 2 more Smart Citations

Applying Characteristic Impedance Compensation Cut-Outs to Full Radio Frequency Chains in Multi-Layer Printed Circuit Board Designs

Barzdenas,

Vasjanov

2024

Sensors

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show abstract

“…The reference plane cut-out compensation technique, also sometimes referred to as compensation using a defected ground structure (DGS), has been a topic of research in multiple papers that cover different case–studies, such as SMA connector pads, track bends, etc., [ 9 , 10 , 11 , 12 ]. The main principle behind reference plane cut-out compensation is altering the per-length-capacitance and per-length-inductance of a discontinuity in a controlled impedance scenario by varying the depth of the reference (ground) plane in a multi-layer PCB.…”

Section: Introductionmentioning

confidence: 99%

A Method of Optimizing Characteristic Impedance Compensation Using Cut-Outs in High-Density PCB Designs

Barzdėnas

Vasjanov

2022

Sensors

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The modern era of technology contains a myriad of high-speed standards and proprietary serial digital protocols, which evolve alongside the microwave and RF realm. The increasing data rate push the requirements for hardware design, including modern printed circuit boards (PCB). One of these requirements for modern high-speed PCB interfaces are a homogenous track impedance all the way from the source to the load. Even though some high-speed interfaces don’t require any external components embedded into the interconnects, there are others which require either passive or active components—or both. Usually, component package land-pads are of fixed size, thus, if not addressed, they create discontinuities and degrade the transmitted signal. To solve this problem, impedance compensation techniques such as reference plane cut-out are employed for multiple case studies covering this topic. This paper presents an original method of finding the optimal cut-out size for the maximum characteristic impedance compensation in high-density multilayer PCB designs, which has been verified via theoretical estimation, computer simulation, and practical measurement results. Track-to-discontinuity ratios of 1:1.75, 1:2.5, and 1:5.0 were selected in order to resemble most practical design scenarios on a 6-layer standard thickness PCB. The measurements and simulations revealed that the compensated impedance saturation occurs at (150–250%) cut-out widths for a 50 Ω microstrip.

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Compensated Stepped Microstrip Lines: A Novel Approach for Impedance Discontinuity Mitigation

Vasjanov,

Barzdenas,

Wang

2024

2024 IEEE Open Conference of Electrical, Electronic and Information Sciences (eStream)

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RF modeling and optimization of end-launch SMA to trace transition

Cited by 8 publications

References 8 publications

Applying Characteristic Impedance Compensation Cut-Outs to Full Radio Frequency Chains in Multi-Layer Printed Circuit Board Designs

Applying Characteristic Impedance Compensation Cut-Outs to Full Radio Frequency Chains in Multi-Layer Printed Circuit Board Designs

A Method of Optimizing Characteristic Impedance Compensation Using Cut-Outs in High-Density PCB Designs

Compensated Stepped Microstrip Lines: A Novel Approach for Impedance Discontinuity Mitigation

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