RF performance of ink-jet printed microstrip lines on rigid and flexible substrates

Sim, Sung-min; Lee, Yeonsu; Kang, Hyelim; Shin, Kwang Yong; Lee, Sang-Ho; Kim, Jung-Mu

doi:10.1016/j.mee.2016.11.011

Cited by 24 publications

(23 citation statements)

References 16 publications

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“…The morphologies of nano-silver are varied, including nanospheres, nanorods, nanorice, nanobipyramids, nanosheets, nanowires, and so on [1,2,3,4,5]. Prompted by current research, the applications of nano-silver in the fields of conductive ink, catalysts, and bactericide have attracted the attention of many researchers [6,7,8,9]. Due to its low resistivity, low sintering temperature, toughness, and low price, nano-silver has been applied to conductive ink by a large number of researchers.…”

Section: Introductionmentioning

confidence: 99%

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Silver Nanowire Ink for Flexible Circuit on Textiles

Yang

et al. 2019

Micromachines

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Low cost electronics implemented in textiles could pave the way to a fully new generation of smart products in the fields of healthcare, sport, fashion, and safety. Although many methods have found their way into the market, many problems still need to be solved and much progress has to be made to enable the commercial exploitation of such products. In this paper, silver nanowires of 60–100 nm in diameter and 8–15 μm in length were achieved by the polyol solvothermal method, and aqueous silver nanowire conductive inks were prepared with the synthesized silver nanowires as the conductive phase, in the presence of polyaniline, guar, and hydrochloric acid. The conductive inks were printed on cotton fabric substrate by screen printing process. The effects of the amount of silver nanowires, layers of coating, and treatment temperature on the microstructure and electrical properties of samples were investigated by scanning electron microscopy and the four-point probe method. The results show that the conductivity and densification of the samples increased with increased amount of silver nanowires, layers of coating, and treatment temperature. The heat treatment helped to improve densification of the silver nanowires and conductivity of the sample. The resistance of the samples increased after bending due to loosening of the overlap between the silver nanowires.

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Section: Introductionmentioning

confidence: 99%

“…However, the resistance of conductive inks configured with nanospheres or silver complexes is high. The reason is the high contact resistance among the nanostructures [5,6,7,8,9]. Silver nanowire, with its one-dimensional structure, has good electrical and thermal conductivity, flexibility, etc.…”

Section: Introductionmentioning

confidence: 99%

Silver Nanowire Ink for Flexible Circuit on Textiles

Yang

et al. 2019

Micromachines

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“…Ink‐jet printing technology has found extensive application in the printed electronics with notable advantages such as no waste of ink, low cost, non‐contact patterning [10]. By using this method with conductive ink, a bump for the flip‐chip bonding can be formed, easily and cost effectively.…”

Section: Introductionmentioning

confidence: 99%

“…The separated CPW and connection parts are fabricated using glass substrate through a photolithography, chrome/gold (20 nm/300 nm) electron-beam evaporation and lift-off process. A bump forming process is carried out using a self-developed ink-jet printing system (Korea Institute of Industrial Technology, Republic of Korea) [10] after Cr/ Au patterning on separated CPW and connection part. First, fluorocarbon (FC) banks are ink-jet printed on the 12 square pads of the separated CPW and the connection part.…”

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confidence: 99%

Simple and low‐loss flip‐chip bonding based on ink‐jet printing for RF applications

et al. 2018

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In this Letter, a flip-chip bonding based on ink-jet printing technology is proposed and verified by interconnecting a separated coplanar waveguide (CPW) samples. Before the flip-chip bonding process, diameter and height of ink-jet printed silver bumps for flip-chip bonding are measured to be about 300 and 13 µm, respectively. In a frequency range from 300 kHz to 3 GHz, return loss and insertion loss of the flip-chip bonded CPW samples are measured to be higher than 20 dB and lower than 1.8 dB, respectively, where the length of the signal line is 35 mm. There are negligible discrepancies between radio frequency (RF) characteristics of the flip-chip bonded CPW and those of a conventional CPW. These results show that the proposed flip-chip bonding can be used to integrate RF components into electronic devices with low-loss using simple procedures.

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“…The paper antenna exhibited a reflection coefficient of −19.7 and −24.7 dB at 2.4 and 5.8 GHz frequencies, respectively, confirming good impedance matching.A red shift (shift to lower values) is observed in the centre frequency, which could be due to the change in the dielectric constant of the substrate, especially at the operating (higher) frequencies. The surface roughness of the photo paper is high, with holes and pits present, which will add some surface roughness and surface inductance terms that can also contribute to the shift[34]. The connector losses, including the losses in the SMA and the presence of Ag epoxy, are also significant, which was not considered in the simulation[35].…”

mentioning

confidence: 99%

Paper-based printed CPW-fed antenna for Wi-Fi applications

Nair¹,

Ray²,

Swaminathan³

2022

Preprint

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A paper-based co-planar waveguide (CPW) fed monopole antenna for Wi-Fi applications is proposed. The antenna is fabricated by printing a commercial silver nanoparticle (Ag NP) based ink on photo paper substrate. The antenna is designed as a single layer for the ease of fabrication, and it is designed to radiate at two frequencies, 2.4 and 5.8 GHz, which are suitable for Wi-Fi applications. The printed film exhibits good electrical conductivity, with a low sheet resistance of 114 mΩ/sq comparable with commonly used conductive metal lines. The fabricated antenna demonstrates good radiative properties at both flat and bent conditions. This confirms the good flexible properties of the antenna making it compatible with mounting on curved surfaces. The performance of the fabricated antenna is also compared with a commercial rigid antenna by interfacing with a USB dongle. The printed antenna demonstrates better performance with respect to signal strength at specific distances when compared with the commercial antenna. This work demonstrates that rigid and long commercial antennas can be replaced with paper-based flexible and cheap antennas and incorporated with wearable technologies. Additionally, replacing Ag NPs with nanowires provides transparency without compromising on the electrical properties.

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RF performance of ink-jet printed microstrip lines on rigid and flexible substrates

Cited by 24 publications

References 16 publications

Silver Nanowire Ink for Flexible Circuit on Textiles

Silver Nanowire Ink for Flexible Circuit on Textiles

Simple and low‐loss flip‐chip bonding based on ink‐jet printing for RF applications

Paper-based printed CPW-fed antenna for Wi-Fi applications

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