2010
DOI: 10.1063/1.3499661
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rf plasma oxidation of Ni thin films sputter deposited to generate thin nickel oxide layers

Abstract: Nickel oxide (NiO) layers were formed on silicon (Si) substrates by plasma oxidation of nickel (Ni) film lines. This ultrathin NiO layer acted as a barrier layer to conduction, and was an integral part of a metal-insulator-metal (MIM) diode, completed by depositing gold (Au) on top of the oxide. The electrical and structural properties of the NiO thin film were examined using resistivity calculations, current-voltage (I-V) measurements and cross-sectional transmission electron microscopy (XTEM) imaging. The fl… Show more

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Cited by 23 publications
(10 citation statements)
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“…There are several techniques to prepare NiO layer, such as thermal oxidation 25 26 , anodic oxidation 27 28 , thermal spray 29 , and plasma oxidation. O 2 plasma-supported oxidation has several advantages over other oxidation techniques, e.g., fast oxidation capability, low temperature process, and ease of forming uniform and dense layer 30 31 . NiO layers are generally formed at high temperatures above 400 °C 32 , but such a high-temperature process cannot be applied to plastic substrate-based flexible devices.…”
Section: Resultsmentioning
confidence: 99%
“…There are several techniques to prepare NiO layer, such as thermal oxidation 25 26 , anodic oxidation 27 28 , thermal spray 29 , and plasma oxidation. O 2 plasma-supported oxidation has several advantages over other oxidation techniques, e.g., fast oxidation capability, low temperature process, and ease of forming uniform and dense layer 30 31 . NiO layers are generally formed at high temperatures above 400 °C 32 , but such a high-temperature process cannot be applied to plastic substrate-based flexible devices.…”
Section: Resultsmentioning
confidence: 99%
“…Capacitively coupled radio frequency (CCRF) plasma has been widely used as a low temperature plasma processing medium for material processing in many fields including microelectronics, aerospace, and biology. [1][2][3][4][5] Due to the energetic ions, chemically active species, radicals, and also energetic neutral species, CCRF discharges are widely studied for various applications in different pressure ranges, ranging from few mTorr to atmospheric pressure. [6][7][8][9][10][11][12][13][14][15][16] In geometrically asymmetric discharge (when the area of the grounded electrode is much larger than the area of the powered electrode), a dc self-bias is generated naturally because of the different electrode sizes and develops in order to compensate electron and ion flux to each electrode within one rf period.…”
mentioning
confidence: 99%
“…There are two routes to fabricate NiO x films by using sputtering method. The first one is similar to the evaporation method, which needs to sputter Ni films first and then oxidize them into NiO x . The other route is called reactive sputtering, which is usually conducted in an oxygen atmosphere, so that the sputtered Ni atoms react with O 2 to form NiO x on the substrates.…”
Section: Niox‐based Planar Pscsmentioning
confidence: 99%