Rheological behavior of thermoset/thermoplastic blends during isothermal curing: Experiments and modeling

Tribut, Laurent; Fenouillot, Françoise; Carrot, Christian; Pascault, J. P.

doi:10.1016/j.polymer.2007.09.008

Cited by 27 publications

(18 citation statements)

References 22 publications

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“…However, the modification of thermosets with thermoplastics would change their rheological behavior. Pascault and coworkers25 reported the rheological behavior of thermoset/thermoplastic blends during isothermal curing and Recca and coworkers26 reported the rheological behavior of blends of novel thermoplastic copolymers and epoxy resins. The phase separation has a great effect on the rheological behavior of the blend.…”

Section: Introductionmentioning

confidence: 99%

The study on poly(ether sulfone) modified cyanate ester resin and epoxy resin cocuring blends

Zhan

et al. 2009

J of Applied Polymer Sci

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Poly(ether sulfone) terminated with phenolic hydroxyl groups modified cyanate ester resin and epoxy resin cocuring blends were investigated by differential scanning calorimetry, Fourier transform infrared spectroscopy, scanning electron microscopy, rheometry, and mechanical properties measurement. The results suggested that poly (ether sulfone) (PES) could accelerate the polycyclotrimerization reaction of cyanate ester and cocuring processes between cyanate ester and epoxy of modified blends because of the presence of phenolic hydroxyl groups at the end of the PES molecules. It was found that the evolution of the morphologies and complex viscosities of the modified blends sensitive to molecular weight and content of PES, the tensile strength and elongation at break of the modified blends were correlated with the morphologies of modified blends. Moreover, the evolution of complex viscosities of the modified blends also showed an exponential growth at the early stage of phase separation, which demonstrated experimentally that the coarsening processes of droplets of bisphenol-A dicyanate and diglycidyl ether of bisphenol A and the final morphologies obtained in the blends modified with PES were affected by viscoelastic behavior.

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Section: Introductionmentioning

confidence: 99%

The study on poly(ether sulfone) modified cyanate ester resin and epoxy resin cocuring blends

Zhan

et al. 2009

J of Applied Polymer Sci

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“…In these thermoplastic/thermosetting resin blends, the polymerization-induced phase separation during the curing process has been well reported. [24][25][26] During isothermal curing of thermoplastic-modified thermosetting resin blends, some structural transformations are expected to occur: phase separation, vitrification of thermoplastic-rich phase, chemical gelation of thermoset, and vitrification of thermoset-rich phase. Unlike thermoplastic/thermoplastic blends, phase separation is induced by the increasing molecular weight of thermosetting resins in the thermosetting/thermoplastic blends even if the temperature is kept constant.…”

Section: Introductionmentioning

confidence: 99%

Rheological Study of Epoxy Systems Blended with Poly(ether sulfone) of Different Molecular Weights

Wang

Foix

et al. 2008

Ind. Eng. Chem. Res.

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In this work, the rheological behavior and structural transitions in poly(ether sulfone) (PES)-modified epoxy systems during phase separation were studied by rheometry instrument, scanning electronic microscopy, timeresolved light scattering, and differential scanning calorimetry. The molecular weight and concentration of PES have profound effects on rheological behavior of modified epoxy systems. It was found that the evolution of complex viscosity is closely connected to the molecular weight of PES. Blends with higher molecular weight PES tend to have a lower conversion at the onset of phase separation and show quicker increase of viscosity with curing process. The complex viscosity exhibits an exponential growing process during phase separation at various temperatures. The relaxation time of rheological growth depends on both molecular weight of PES and test frequency.

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“…[6][7][8][9][10][11][12] Many studies have reported on the usage of the immiscible polymer blend in thermoset/thermoplastic to provide a double percolation condition in order to lower the P c . [13][14][15] In general, thermoset/thermoplastic blend systems can be prepared using several methods, including, melt blending, [16][17][18][19][20][21] high temperature mixing, [18,22] and solvent deposition. [23][24][25][26] Studies are focused on the dispersion of filler and the optimum filler loading in relation to the electrical conductivity of the composites.…”

Section: Introductionmentioning

confidence: 99%

Influence of thermoplastic spacer on the mechanical, electrical, and thermal properties of carbon black filled epoxy adhesives

Phua

Teh

Ghani

et al. 2016

Polymers for Advanced Techs

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A new approach of mimicking the selective localization mechanism of conductive filler into one phase of immiscible polymer blend system is proposed here, where a moderate fine of polymethylmethacrylate (PMMA) powder is prepared and used as the spacer in the carbon black (CB) filled epoxy adhesives system that can be applied at room temperature. The main purpose of PMMA‐spacer is to promote the formation of conductive networks via aiding the 3D self‐assembly of CB filler, selectively in the continuous phase of epoxy. PMMA‐spacer content ranged from 10, 20, 30, 40, and 50 vol.% were investigated under electrical, mechanical, and thermal properties for both unfilled and 15 vol.% CB filled system. With the incorporation of 10 vol.% PMMA‐spacer, the filled system shows promising improvement in electrical conductivity, with three order of magnitude increment at 15 vol.% CB loading. Toughening mechanism of epoxy was observed, where crack deflection upon the PMMA‐spacer is observed under scanning electron microscopy characterization and agreed by fracture toughness calculation. Thermal stability and coefficient of thermal expansion were improved at the minimum addition of PMMA‐spacer content, at 10 vol.%, while a small reduction in flexural strength is observed because of the poor interface interaction between the PMMA‐spacer and epoxy matrix. Interestingly, a limited interaction between the PMMA‐spacer with epoxy at the curing temperature of 100°C is observed, indicating the solubility of PMMA‐spacer in epoxy before crosslinking process occurred. Copyright © 2016 John Wiley & Sons, Ltd.

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Rheological behavior of thermoset/thermoplastic blends during isothermal curing: Experiments and modeling

Cited by 27 publications

References 22 publications

The study on poly(ether sulfone) modified cyanate ester resin and epoxy resin cocuring blends

The study on poly(ether sulfone) modified cyanate ester resin and epoxy resin cocuring blends

Rheological Study of Epoxy Systems Blended with Poly(ether sulfone) of Different Molecular Weights

Influence of thermoplastic spacer on the mechanical, electrical, and thermal properties of carbon black filled epoxy adhesives

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