2006
DOI: 10.1002/app.24674
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Rheological study of the curing kinetics of epoxy–phenol novolac resin

Abstract: ABSTRACT:The curing reaction of an epoxy-phenolic resin under different conditions was monitored using rheological measurements. The evolution of viscoelastic properties, such as storage modulus, G 0 , and loss modulus, G 00 , was recorded. Several experiments were performed to confidently compare the rheological data obtained under varied curing conditions of temperature, catalyst concentration, and reactive ratios. The values of G 0 measured at the end of the reactions (at maximum conversion) were independen… Show more

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Cited by 39 publications
(18 citation statements)
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“…The isothermal rheological spectra of PF and PRFR‐2, G ′, G ′′, and η with time at 105 °C are shown in Figure . As exhibited in Figure (a,b), the profiles of G ′ and G ′′ of PFR and PRFR‐2 correlated with shape of the profiles of the thermosetting resins as previously reported . At the beginning of the cross‐linking reactions, the modulus and complex viscosity increased slowly because the resins needed higher temperatures or additional time to cure.…”
Section: Resultssupporting
confidence: 84%
See 1 more Smart Citation
“…The isothermal rheological spectra of PF and PRFR‐2, G ′, G ′′, and η with time at 105 °C are shown in Figure . As exhibited in Figure (a,b), the profiles of G ′ and G ′′ of PFR and PRFR‐2 correlated with shape of the profiles of the thermosetting resins as previously reported . At the beginning of the cross‐linking reactions, the modulus and complex viscosity increased slowly because the resins needed higher temperatures or additional time to cure.…”
Section: Resultssupporting
confidence: 84%
“…As exhibited in Figure 7(a,b), the profiles of G 0 and G 00 of PFR and PRFR-2 correlated with shape of the profiles of the thermosetting resins as previously reported. 26 At the beginning of the cross-linking reactions, the modulus and complex viscosity increased slowly because the resins needed higher temperatures or additional time to cure. As time progressed, G 0 , G 00 , and h of the resins increased rapidly and reached fixed values.…”
Section: Resultsmentioning
confidence: 99%
“…The decrease considered to be a physical softening process that caused only by the temperature of the noncured resin, often symbolized with T g0 . 38 At 21 to 81 minutes, G′, G″, and tan δ of MPR/GF prepreg showed an approximate plateau and reached a minimum value, which is caused by the release of volatiles and the very slow curing reaction during the precuring process. At 81 to 240 minutes, there was a rapid increasing for G′, where G″ and tan δ increased to a peak, firstly, and then, the 2 values decreased gradually in that a large number of curing reaction occurred during the isothermal at 150°C.…”
Section: The Curing Behavior Mpr/gf Prepregmentioning
confidence: 97%
“…The profiles of the resin's curing degree can be calculated from a rheological variable such as the complex modulus (G*), the elastic modulus (G 0 ), or the resulting torque (C) value according to different authors. [40][41][42][43] In this work, we used the logarithm of the material's normalized elastic modulus to obtain the mechanical curing degree [a(t)] of resol resin. The elastic modulus was chosen as a suitable rheological variable, because the high G 0 values found caused low dispersion in the measurements.…”
Section: Profiles Of the Resin's Mechanical Curing Degreementioning
confidence: 99%