Rheology of curing thermosets: A review

Roller, M. B.

doi:10.1002/pen.760260610

Cited by 130 publications

(61 citation statements)

References 19 publications

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“…The DSC data are faster to obtain, but they do not include the needed viscosity information. Several corrections have been proposed, addressing different orders of reaction (90) (the above assumes first order) and modifications to the equations (92). Many of these adjustments are reported in Roller's 1986 review (92) of curing kinetics.…”

Section: Isothermal Curing Studiesmentioning

confidence: 99%

Dynamic Mechanical Analysis in the Analysis of Polymers and Rubbers

Menard

2015

Encyclopedia of Polymer Science and Technology

105

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DYNAMIC MECHANICAL ANALYSISsixties when commercial instruments became more user-friendly. About 1966, Gillham developed the TBA (10) and started the modern period of DMA. In 1971, Starita and Macosko (11) built a DMA that measured normal forces and from this came the Rheometrics Corporation. In 1976, Bohlin also developed a commercial DMA and started Bohlin Rheologia. Both instruments used torsional geometry. The early instruments were, regardless of manufacturer, difficult to use, slow, and limited in their ability to process data. In the late seventies, Murayani (12) and Read and Brown (13) wrote books on the uses of DMA for material characterization. Several thermal and rheological instrument companies introduced DMA's in the same time period, and currently most thermal and rheological vendors offer some type of DMA. Polymer Labs offered a dynamic mechanical thermal analyzer (DMTA using an axial geometry in the early 1980s. This was soon followed by an instrument from Du Pont. Perkin-Elmer developed a controlled stress analyzer based on their thermomechanical analyzer (TMA) technology, which was designed for increased low-end sensitivity. Triton Technologies, acquired by Mettler Toledo in 2010, developed a very easy to use design that formalized both immersion and humidity methods. On the high force end of applications, Mettler Toledo also makes an instrument capable of 40 N loads and both Gabo and MetaVib work exclusively in high load instruments. Small vendors include Hitachi, Bosch, and others. The competition between vendors has led to easier to use, faster, and less expensive instruments. The revolution in computer technology, which has so affected the laboratory, changed the latter, and DMA of all types became more user-friendly as computers and software evolved. This movement to easier to use instruments has led to more use in quality control and the development of ASTM standards (14).

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Section: Isothermal Curing Studiesmentioning

confidence: 99%

Dynamic Mechanical Analysis in the Analysis of Polymers and Rubbers

Menard

2015

Encyclopedia of Polymer Science and Technology

105

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“…They range from empirical models, 5,6 probability based models, 7,8 gelation models, 9,10 to models based on free volume analysis. 11 The most commonly used empirical model has the form: 5 Isothermal conditions: ᐉn͑t͒…”

Section: Chemoviscosity Modelingmentioning

confidence: 99%

Cure modeling and monitoring of epoxy/amine resin systems. II. Network formation and chemoviscosity modeling

Karkanas¹,

Partridge²

2000

J. Appl. Polym. Sci.

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“…They range from empirical models, [6,7] probability based models, [8,9] gelation models, [10] to models based on free volume analysis, [11,12] etc. A brief introduction for these models can be found in other papers.…”

Section: Introductionmentioning

confidence: 99%

Rheology Study of Wafer Level Underfill

Sun

Zhang

Wong

2005

Macro Materials & Eng

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Summary: As a special epoxy resin material used in the electronics packaging, wafer level underfill (WLU) is studied using a chemorheology approach to provide a fundamental understanding of its reaction dependent rheology behaviors. In this work, the relationship between the molecular weight ($\overline M _{\rm w}$) and the viscosity of the epoxy resins at fixed temperatures has been established. Subsequently an Arrhenius‐Erying equation was used to fit the relationship between viscosity and temperature for given molecular weight epoxies. By combining the two relationships, the viscosity could be modeled as a function of temperature and molecular weight. To obtain the viscosity change of the WLU during the reflow process, the molecular weight change of the underfill was calculated from the degree of curing through the kinetics modeling. A semi‐empirical model was developed to predict the viscosity of the underfill as a function of time and temperature during the curing process. Modeled predictions were compared with experimental data under isothermal and ramping temperatures during curing experiments. The model showed good agreement with the experiments in the early stage of curing reaction. The critical viscosity of the underfill for solder wetting was obtained by wetting experiments, which can be used as the criteria to determine the flowability of the wafer level underfill.Data fitting of the viscosity model at isothermal condition.magnified imageData fitting of the viscosity model at isothermal condition.

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Rheology of curing thermosets: A review

Cited by 130 publications

References 19 publications

Dynamic Mechanical Analysis in the Analysis of Polymers and Rubbers

Dynamic Mechanical Analysis in the Analysis of Polymers and Rubbers

Cure modeling and monitoring of epoxy/amine resin systems. II. Network formation and chemoviscosity modeling

Rheology Study of Wafer Level Underfill

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