Robust polymer-based paper-like thermal interface materials with a through-plane thermal conductivity over 9 Wm−1K−1

Feng, Chang‐Ping; Chen, Li-Bo; Tian, Guo-Liang; Bai, Lu; Bao, Rui‐Ying; Liu, Zhengying; Ke, Kai; Yang, Ming‐Bo; Yang, Wei

doi:10.1016/j.cej.2019.123784

Cited by 80 publications

(37 citation statements)

References 64 publications

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“…PVA film packed with raw-ABN had the filler broken so that the shape of the ABN could not be recognized, whereas PSZ-ABN maintained the shape of the ABN well. When packing the polymer matrix of a certain thickness, it has been reported that the use of a filler having a size similar to that of the film provides advantages with respect to increasing the thermal conductivity [ 29 ]. It is suggested that the ABN particles form linear arrangements that can provide an effective pathway for heat transfer within the PVA film.…”

Section: Resultsmentioning

confidence: 99%

Incorporating MXene into Boron Nitride/Poly(Vinyl Alcohol) Composite Films to Enhance Thermal and Mechanical Properties

Lee

Kim

2021

Polymers

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Aggregated boron nitride (ABN) is advantageous for increasing the packing and thermal conductivity of the matrix in composite materials, but can deteriorate the mechanical properties by breaking during processing. In addition, there are few studies on the use of Ti3C2 MXene as thermally conductive fillers. Herein, the development of a novel composite film is described. It incorporates MXene and ABN into poly(vinyl alcohol) (PVA) to achieve a high thermal conductivity. Polysilazane (PSZ)-coated ABN formed a heat conduction path in the composite film, and MXene supported it to further improve the thermal conductivity. The prepared polymer composite film is shown to provide through-plane and in-plane thermal conductivities of 1.51 and 4.28 W/mK at total filler contents of 44 wt.%. The composite film is also shown to exhibit a tensile strength of 11.96 MPa, which is much greater than that without MXene. Thus, it demonstrates that incorporating MXene as a thermally conductive filler can enhance the thermal and mechanical properties of composite films.

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Section: Resultsmentioning

confidence: 99%

Incorporating MXene into Boron Nitride/Poly(Vinyl Alcohol) Composite Films to Enhance Thermal and Mechanical Properties

Lee

Kim

2021

Polymers

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“…The major properties of common materials for thermal fabrication are good thermal conductivity, mechanical compliance, thermal stability, and flexibility 108,113 . Several studies have suggested the achieved value of thermal conductivity, namely, 5 W/m.K (plastic materials), 114 1 to 5 W/m.K (conventional thermal interface materials, for example, polymer matrices filled with thermally conductive materials, such as boron nitride, aluminum nitride, and alumina), 115 and 9 W/m.K (polymer‐based materials) 116 . Research should also aim to minimize thermal resistance rather than focus on increasing thermal conductivity.…”

Section: Important Factors For Enhancing Thermal Management Performancementioning

confidence: 99%

“…108,113 Several studies have suggested the achieved value of thermal conductivity, namely, 5 W/m.K (plastic materials), 114 1 to 5 W/m.K (conventional thermal interface materials, for example, polymer matrices filled with thermally conductive materials, such as boron nitride, aluminum nitride, and alumina), 115 and 9 W/m.K (polymer-based materials). 116 Research should also aim to minimize thermal resistance rather than focus on increasing thermal conductivity. A relation exists between the volume fraction of the fillers and the bulk resistance of materials due to the adhesion effect and surface contact.…”

Section: Advanced Materials In Fabricationmentioning

confidence: 99%

Thermal management of wearable and implantable electronic healthcare devices: Perspective and measurement approach

2020

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Summary The performance of electronic devices, mostly in medical applications, has been investigated to determine whether they meet the requirements of healthcare monitoring and patient's satisfaction. Mobile health monitoring is preferable at present given the current innovations in handheld, wearable, and implantable devices. However, these applications require appropriate thermal management because they are attached directly to the human body and operate for a long period. Moreover, a sophisticated design with functional mobility necessitates proper thermal circulation during the process. This review provides the current research direction for cooling systems, the thermal working principle of wearable and implantable devices, and its implementation on design architecture. Then, the importance of internal and external functional properties in thermal management and their effects on device performance are discussed. Operating temperature is among the most important elements in monitoring thermal performance due to the tendency of tissue and component damages to occur after an increment of only 1°C or 2°C in temperature. Challenges and available solutions for thermal management are listed in detail to improve cooling methods and service to the healthcare field.

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“…Graphene, a honeycomb two-dimensional material, possesses good thermal and electrical property [ 15 , 16 , 17 ]. Thanks to its excellent intrinsic thermal conductivity (3500–5300 W m −1 K −1 ) and advantages for mass production [ 18 , 19 , 20 ], graphene-based paper has attracted significant attention for the development of TIMs [ 21 , 22 , 23 , 24 , 25 , 26 , 27 , 28 , 29 ]. Feng et al developed a graphene paper-like TIM with a thickness in the range of 90–120 μm; it demonstrated good heat dissipation for CPU cooling because of its high through-plane thermal conductivity of 9 W m −1 K −1 [ 23 ].…”

Section: Introductionmentioning

confidence: 99%

“…Thanks to its excellent intrinsic thermal conductivity (3500–5300 W m −1 K −1 ) and advantages for mass production [ 18 , 19 , 20 ], graphene-based paper has attracted significant attention for the development of TIMs [ 21 , 22 , 23 , 24 , 25 , 26 , 27 , 28 , 29 ]. Feng et al developed a graphene paper-like TIM with a thickness in the range of 90–120 μm; it demonstrated good heat dissipation for CPU cooling because of its high through-plane thermal conductivity of 9 W m −1 K −1 [ 23 ]. Nan et al applied nanodiamond particles for intercalation into functionalized graphene oxide to construct a composite graphene paper with adjustable thickness, enhancing the thermal conductivity of graphene paper by 33%, which enabled improving the heat dissipation performance for LED cooling [ 24 ].…”

Section: Introductionmentioning

confidence: 99%

Surface Modification Using Polydopamine-Coated Liquid Metal Nanocapsules for Improving Performance of Graphene Paper-Based Thermal Interface Materials

Gao

Tan

et al. 2021

Nanomaterials

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Given the thermal management problem aroused by increasing power densities of electronic components in the system, graphene-based papers have raised considerable interest for applications as thermal interface materials (TIMs) to solve interfacial heat transfer issues. Significant research efforts have focused on enhancing the through-plane thermal conductivity of graphene paper; however, for practical thermal management applications, reducing the thermal contact resistance between graphene paper and the mating surface is also a challenge to be addressed. Here, a strategy aimed at reducing the thermal contact resistance between graphene paper and the mating surface to realize enhanced heat dissipation was demonstrated. For this, graphene paper was decorated with polydopamine EGaIn nanocapsules using a facile dip-coating process. In practical TIM application, there was a decrease in the thermal contact resistance between the TIMs and mating surface after decoration (from 46 to 15 K mm2 W−1), which enabled the decorated paper to realize a 26% enhancement of cooling efficiency compared with the case without decoration. This demonstrated that this method is a promising route to enhance the heat dissipation capacity of graphene-based TIMs for practical electronic cooling applications.

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Robust polymer-based paper-like thermal interface materials with a through-plane thermal conductivity over 9 Wm−1K−1

Cited by 80 publications

References 64 publications

Incorporating MXene into Boron Nitride/Poly(Vinyl Alcohol) Composite Films to Enhance Thermal and Mechanical Properties

Incorporating MXene into Boron Nitride/Poly(Vinyl Alcohol) Composite Films to Enhance Thermal and Mechanical Properties

Thermal management of wearable and implantable electronic healthcare devices: Perspective and measurement approach

Surface Modification Using Polydopamine-Coated Liquid Metal Nanocapsules for Improving Performance of Graphene Paper-Based Thermal Interface Materials

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