2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 2022
DOI: 10.1109/ectc51906.2022.00126
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Robustness and Reliability of Novel Anisotropic Conductive Epoxy for Stretchable Wearable Electronics

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Cited by 6 publications
(2 citation statements)
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“…A commercial ACA (ZTACH ACE, SunRay Scientific) was applied as a bonding material to provide mechanically robust electrical connections E-textile to E-textile, E-textile to SMD resistor, and E-textile to electronic module board. 733 The adhesive can be cured at low temperature (140 °C for 15 s) or UV light in the presence of a magnetic field, which makes it require less pressure during assembly and enables the potential for large-scale manufacturing. Besides epoxy-based adhesives, PU-based and silicone-based conductive adhesives with lower modulus have been developed to endow the adhesive with better flexibility and stretchability.…”
Section: Connection Of Rigid Electronics On Textilesmentioning
confidence: 99%
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“…A commercial ACA (ZTACH ACE, SunRay Scientific) was applied as a bonding material to provide mechanically robust electrical connections E-textile to E-textile, E-textile to SMD resistor, and E-textile to electronic module board. 733 The adhesive can be cured at low temperature (140 °C for 15 s) or UV light in the presence of a magnetic field, which makes it require less pressure during assembly and enables the potential for large-scale manufacturing. Besides epoxy-based adhesives, PU-based and silicone-based conductive adhesives with lower modulus have been developed to endow the adhesive with better flexibility and stretchability.…”
Section: Connection Of Rigid Electronics On Textilesmentioning
confidence: 99%
“…However, the assembly process requires high temperature and pressure, and high contact resistance results when using this technique. A commercial ACA (ZTACH ACE, SunRay Scientific) was applied as a bonding material to provide mechanically robust electrical connections E-textile to E-textile, E-textile to SMD resistor, and E-textile to electronic module board . The adhesive can be cured at low temperature (140 °C for 15 s) or UV light in the presence of a magnetic field, which makes it require less pressure during assembly and enables the potential for large-scale manufacturing.…”
Section: Integrated Wearable Systems Based On Pctsmentioning
confidence: 99%