2015
DOI: 10.1016/j.scriptamat.2014.11.034
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Role of Ag-alloy in the thermal stability of Ag-based ohmic contact to GaN(0 0 0 1) surface

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Cited by 7 publications
(3 citation statements)
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“…Alloying is a simple and effective method for improving the performance of pure metals [6,7]. Among the numerous available alloys [8][9][10], Ag-Cu alloys [11,12] are a commonly used silver alloy for electrical contacts and decoration purposes, due to its improved mechanical performance, good electrical and thermal conductivity, and moderate cost. However, the introduction of the Cu element reduces the Ag's chemical stability, such that the Ag-Cu alloy is more likely to react with the element sulfur to generate black sulfides, in comparison to pure silver [13].…”
Section: Introductionmentioning
confidence: 99%
“…Alloying is a simple and effective method for improving the performance of pure metals [6,7]. Among the numerous available alloys [8][9][10], Ag-Cu alloys [11,12] are a commonly used silver alloy for electrical contacts and decoration purposes, due to its improved mechanical performance, good electrical and thermal conductivity, and moderate cost. However, the introduction of the Cu element reduces the Ag's chemical stability, such that the Ag-Cu alloy is more likely to react with the element sulfur to generate black sulfides, in comparison to pure silver [13].…”
Section: Introductionmentioning
confidence: 99%
“…The agglomeration usually causes a light scattering phenomenon and decreased conductivity with respect to the initial smooth layer, thus decreasing the specular reflection and conductivity [6][7][8][9][10]. In the past decade, thermal stability or thermal degradation (i.e., agglomeration) of Ag films on GaN-related semiconductors for LEDs have been extensively investigated in many studies [11][12][13][14][15][16][17][18][19][20]. One solution for improving the thermal stability of Ag films was proposed by adopting capping layers like NiZn alloy [11], SnO 2 [12], Zn [13], and IZO [15] on Ag films, or using interlayers like Ni [14] and Ir [15] layers beneath the Ag films, to retard the Ag agglomeration process at high temperature.…”
Section: Introductionmentioning
confidence: 99%
“…La [17], Ni [18], Zn or Sn [19,20] into Ag films to hinder the migration of Ag grains at high temperature. Moreover, Ag reacts readily with sulfur around and forms a silver sulfide film on the surface during assembling process and application circumstance, thus lowering their reflective performance and luminous efficiency of LED packages.…”
Section: Introductionmentioning
confidence: 99%