Role of Bi, Sb and In in microstructure formation and properties of Sn-0.7Cu-0.05Ni-X BGA interconnections

Belyakov, S. A.; Nishimura, Tetsuro; Akaiwa, Tetsuya; Sweatman, Keith; Nogita, Kazuhiro; Gourlay, C.M.

doi:10.23919/icep.2019.8733493

Cited by 5 publications

(4 citation statements)

References 16 publications

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“…9b1-g1), the phase fraction of Bi particles, Cu 6 Sn 5 , and the sum of the two of them decreased with the In content increasing from 1 to 3 wt.%, showing a linear decline in slope. This trend is consistent with the conclusion of Belyakov et al [4]. Increasing the content of In, on the one hand, increases the solid solution strengthening part caused by the solution of Bi and In in the matrix, on the other hand, the addition of In reduces the precipitation of Bi particles and Cu6(Sn, In)5, making the precipitation strengthening part weak.…”

Section: Mechanical Performance Corresponded To Sb/in Additionssupporting

confidence: 92%

“…The SAC305 alloy is a typical precipitation strengthening alloy, which is strengthened by insoluble and incoherent second phase particle, i.e. Ag 3 Sn and Cu 6 Sn 5 intermetallic (IMC) [2][3][4][5]. These strengthening effects meet the thermal reliability requirement in consumer electronics applications within − 25°C ~ 125°C [6; 7] and high temperature storage at maximum 150°C [8,9].…”

Section: Introductionmentioning

confidence: 99%

“…During thermomechanical fatigue, the β-Sn matrix recrystallization and IMC particles coarsening have tendency to occur at the locations where the strain is concentrated [18]. Thus, introducing solid solution strengthening into precipitation hardening tin based alloys can effectively improve the high temperature resistance of the β-Sn matrix [20,21]. For β-Sn matrix, solid solution strengthening can be achieved by Bi, Sb, In without obvious oxidation [4,15,22,23].…”

Section: Introductionmentioning

confidence: 99%

“…Thus, introducing solid solution strengthening into precipitation hardening tin based alloys can effectively improve the high temperature resistance of the β-Sn matrix [20,21]. For β-Sn matrix, solid solution strengthening can be achieved by Bi, Sb, In without obvious oxidation [4,15,22,23].…”

Section: Introductionmentioning

confidence: 99%

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Microstructures and shear properties of Sb and In strengthened Sn5Bi/Cu joints

Zhang,

Zhao,

Wang

et al. 2023

Preprint

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The effects of x(Sb/In) (x = 1, 2, 3 wt.%) added to Sn5Bi solder alloy on the melting properties, microstructures and the shear behavior of solder/Cu joints were investigated combined with the corresponding phase diagram. It is found that the addition of Sb reduces the melting range and supercooling with the increase of Sb content caused by SnSb formation, while the In addition can reduce the melting point resulted by In solid solution. Both Sn5BixIn/Cu and Sn5BixSb/Cu are mainly composed of β-Sn and two types precipitates, i.e. Bi particles and Cu6Sn5 compound. The difference lies in that In doping only can dissolve into β-Sn and Cu6Sn5 while Sb doping mainly form tiny SnSb. Increase In content also inhibit precipitation of Bi particles and reduce the phase fraction Cu6(SnIn)5, resulting in that precipitation strengthening becomes weaker and solid solution strengthening becomes stronger. In contrast, the phase fraction of Bi particles and Cu6Sn5 increases with increasing Sb content, leading to that precipitation strengthening becomes stronger. These strengthening mechanism causes that their ultimate shear force monotonically increases with increasing Sb and In content, and the strengthening effect of the Sb element is better. Sb and In addition also can improve the ductility of Sn5Bi/Cu solder joints and both 2 wt.% In/Sb addition present the best shear fracture work. Thus, the optimal mechanical property was achieved by 2 wt.% Sb addition.

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Section: Mechanical Performance Corresponded To Sb/in Additionssupporting

confidence: 92%