Role of dielectric material and geometry on the thermo-mechanical reliability of microvias

Ramakrishna, Gnyaneshwar; Liu, Fuhan; Sitaraman, S.K.

doi:10.1109/ectc.2002.1008133

Cited by 19 publications

(6 citation statements)

References 6 publications

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“…Micro vias are being used in increasing numbers in the electronics industry because they provide increased interconnection density on smaller substrates. Despite the importance of micro vias, only a limited number of studies have been carried out regarding them (Ramakrishna et al, 2002;Nah et al, 2001;Lau and Lee, 2002). As a result, important questions such as how micro vias affect the reliability of solder joints and void formation, or how they compare with land pads, remain relatively unanswered.…”

Section: Introductionmentioning

confidence: 99%

The effect of PCB surface finish on lead‐free solder joints

Nurmi

Sundelin²,

Ristolainen³

et al. 2005

Soldering &Amp; Surface Mount Technology

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Purpose -To study the behaviour of voids in PBGA solder joints and their influence on the lifetime of lead-free solder joints. Design/methodology/approach -The behaviour of voids was studied using micro via and land pad PWBs, PBGA components, and by measuring voids in the solder joints. The lifetimes of solder joints were tested using accelerated temperature tests. Findings -Number of factors affecting the solder joint lifetimes were found. The voids were discovered to have a significantly large influence on the solder joints. Practical implications -The findings can be used to achieve better soldering results, methods, and designs. Originality/value -In this paper, the effect and the behaviour of voids were studied profoundly. The findings can be valuable to researchers and process personnel.

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Section: Introductionmentioning

confidence: 99%

The effect of PCB surface finish on lead‐free solder joints

Nurmi

Sundelin²,

Ristolainen³

et al. 2005

Soldering &Amp; Surface Mount Technology

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“…[8] And its Prony series are applied to analyze the embedded capacitor by ANSYS software. [9][10] with the application of element birth and death technology. The PLANE183 is used to mesh model, and finite element model is shown in Fig.5.…”

Section: Process Simulation and Results Analysismentioning

confidence: 99%

Study on process of embedded passives based on FR4 substrate series

Qiu

Pan

et al. 2010

2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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The fabrication of embedded passives represents a promising solution for system in package (SiP) regarding the reduction of size and assembly costs. But the thermomechanical deformation caused by residual stress generated from embedded passives processing have a significant impact on reliability of embedded passives. Due to the complication of embedded passives processing, there are several challenges in simulating the process of embedded passives, such as timevariation structures and boundary conditions. In this study, the finite element model of embedded capacitor is developed and employed to simulate the process of embedded passives with the application of element birth and death technology. The results represent that the maximum displacement take place at the outermost substrate after the process. In addition, the stress concentration is also found in the micro-vias. And then the stress field of process simulation is the initial stress field of the subsequent finite element analysis, the reliability of embedded capacitor is studied by coupling residual stress with accelerated thermal cycling. Comparative analysis of simulation result and experimental result, the results show that the micro-via in the lateral substrate has been obvious deformed, which will result in signal integrity problems and other reliability problems. In addition, the stress concentration is also found in the micro-vias. In the subsequent uncoupling analysis, an assumption made for the finite element analysis is that there is not residual stress in the embedded substrate. The result shows that that the maximum deformation did not take place at the micro-via of substrate, which is not accord with practice and results of coupling analysis. So in the study of process and thermo-mechanical reliability, residual stress of embedded process must be considered.

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“…The properties are obtained using dynamic mechanical analysis (DMA) and digital scanning calorimetry (DSC). The viscoelastic material properties of the dielectric and the soldermask are represented by the Maxwell model using Prony Series [13], [14]. The properties of fully cured ViaLux [14] are used in the analysis.…”

Section: B Materials Modelsmentioning

confidence: 99%

Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates

Lee

Damani

Pucha

et al. 2007

IEEE Trans. Comp. Packag. Technol.

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Understanding and quantifying the RLC characteristics of the embedded passives under thermomechanical deformation during fabrication and accelerated thermal conditions is necessary for their successful implementation. Embedded passives are composite layers with dissimilar material properties compared to the neighboring layers in the integral substrate. The ongoing project explores the fabrication, multifield physics-based reliability modeling and accelerated testing of embedded passive test vehicles. As a first step, in this paper, the effect of thermomechanical deformation on the electrical characteristics of embedded capacitors is studied at frequencies from 100 KHz to 2 GHz using two test vehicles. Test vehicles with embedded passives were fabricated and were subjected to accelerated thermal cycles between 55 C to 125 C, between 40 C to 125 C and high humidity and temperature conditions of 85 C/85% RH. Significant changes in the electrical parameters of the embedded capacitors are observed. The fabrication process mechanics with multiphysics global-local modeling methodology is demonstrated to study the effect of thermal cycling on the electrical characteristics of embedded capacitors. The results obtained from the multiphysics global-local modeling methodology are validated against the measured electrical characteristics of the fabricated functional test boards. The effect of changes in electrical parameters of embedded passives on system performance of low-pass filters is presented.

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Role of dielectric material and geometry on the thermo-mechanical reliability of microvias

Cited by 19 publications

References 6 publications

The effect of PCB surface finish on lead‐free solder joints

The effect of PCB surface finish on lead‐free solder joints

Study on process of embedded passives based on FR4 substrate series

Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates

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