Role of erbium in microstructure and mechanical properties of Sn58Bi42 solder alloy

Xu, Qiman; Ding, Xiaohan; Chen, Chen; Zhou, Jian; Xue, Feng; Chen, Qin

doi:10.1016/j.matlet.2021.130745

Cited by 7 publications

(1 citation statement)

References 11 publications

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“…therefore, the improvement in the existing lead-free solder alloys was necessary as well as to keep pace with the current advancement in the electronic products. recent research has investigated on the addition of alloying elements in the solder alloys such as bismuth (Bi), phosphorus (P), gallium (Ga) and so on [8][9][10].the presence of these alloying elements has proven to improve the properties and performance of existing lead-free solder alloys [2,11].…”

Section: Introductionmentioning

confidence: 99%

A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy

Zaimi,

Salleh,

Al Bakri Abdullah

et al. 2023

Archives of Metallurgy and Materials

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A Short review on the influence of Antimony Addition to the microStructure And thermAl ProPertieS of leAd-free Solder Alloy for long time, Sn-Pb solder alloys have been used extensively as the main interconnection materials in the soldering. it is no doubt that Sn-Pb offers many advantages including good electrical conductivity, mechanical properties as well as low melting temperature. however, Pb is very toxic and Pb usage poses risk to human health and environments. owing to this, the usage of Pb in the electronic industry was banned and restricted by the legislation. these factors accelerate the efforts in finding suitable replacement for solder alloy and thus lead-free solder was introduced. the major problems associated with lead-free solder is the formation of large and brittle intermetallic compound which have given a rise to the reliability issues. Micro alloying with Sb seems to be advantageous in improving the properties of existing lead-free solder alloy. thus, this paper reviews the influence of Sb addition to the lead-free solder alloy in terms of microstructure formations and thermal properties.

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