Role of nanoscale Cu/Ta interfaces on the shock compression and spall failure of nanocrystalline Cu/Ta systems at the atomic scales

Chen, Jie; Tschopp, Mark A.; Dongare, Avinash M.

doi:10.1007/s10853-017-1879-7

Cited by 31 publications

(7 citation statements)

References 66 publications

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“…The "dislocation extraction algorithm" (DXA) 64,65 and "crystal analysis tool" (CAT) 66 ) and hence, cannot be distinguished from each other. The methodology to characterize twining partials can be found in 28,30,31,40,41,54 . In addition, twins are characterized in Ta based on Euler angles that represent the local orientation of each atom.…”

Section: Methodsmentioning

confidence: 99%

“…(b) Does the observed length scale dependence of spall strength values for the multilayered structures also exist for all interface structures? While the current state-of-art experimental capabilities use in situ femtosecond XRD for characterization of deformation mechanisms under shock loading conditions [23][24][25] , such questions are still very challenging to explore experimentally, given both the small length scales of the phenomena and the short time scales over which they occur.Molecular dynamics (MD) simulations can provide atomic-scale resolution of the processes occurring under dynamic loading conditions, thus enabling us to unravel the microstructural features contributing to the shock response and spall failure behavior [26][27][28][29][30][31][32] . While MD simulations have provided valuable insights on the role of interface structure and spacing on the defect (dislocations, twins) nucleation, evolution and transmission behavior in multilayered microstructures [33][34][35][36][37][38][39] , the understanding of the shock response and spall failure behavior is still in infancy.…”

mentioning

confidence: 99%

“…Molecular dynamics (MD) simulations can provide atomic-scale resolution of the processes occurring under dynamic loading conditions, thus enabling us to unravel the microstructural features contributing to the shock response and spall failure behavior [26][27][28][29][30][31][32] . While MD simulations have provided valuable insights on the role of interface structure and spacing on the defect (dislocations, twins) nucleation, evolution and transmission behavior in multilayered microstructures [33][34][35][36][37][38][39] , the understanding of the shock response and spall failure behavior is still in infancy.…”

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confidence: 99%

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Unraveling the Role of Interfaces on the Spall Failure of Cu/Ta Multilayered Systems

Chen

Mathaudhu

Thadhani

et al. 2020

Sci Rep

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Molecular dynamics (MD) simulations are carried out to investigate the effects of the type and spacing of fcc/Bcc interfaces on the deformation and spall behavior. the simulations are carried out using model Cu/Ta multilayers with six different types of interfaces. The results suggest that interface type can significantly affect the structure and intensity of the incoming shock wave, change the activated slip systems, alter dislocation slip and twinning behavior, affect where and how voids are nucleated during spallation and the resulting spall strength. Moreover, the above aspects are significantly affected by the interface spacing. A transition from homogeneous to heterogeneous dislocation nucleation occurs as the interface spacing is decreased to 6 nm. Depending on interface type and spacing, damage (voids) nucleation and spall failure is observed to occur not only at the Cu/Ta interfaces, but also in the weaker Cu layer interior, or even in the stronger Ta layer interior, although different mechanisms underlie each of these three distinct failure modes. These findings point to the fact that, depending on the combination of interface type and spacing, interfaces can lead to both strengthening and weakening of the cu/ta multilayered microstructures.Nanoscale multilayered materials are an emerging class of materials that render a unique combination of high thermal stability, strength, and damage resistance 1,2 . This unique response is due to a high density of interfaces in the microstructure that can be used to tailor their performance. Multilayer microstructures, therefore, are very promising materials for next-generation damage-tolerant applications. Recent advancements in experimental capabilities based on accumulative roll bonding (ARB) 3 , and physical vapor deposition (PVD) 4 has enabled the fabrication of a wide range of novel FCC/BCC bi-metallic multilayered microstructures. Such capabilities open up opportunities to tailor the interface structure and spacing in designing damage-resistant microstructures.A substantial amount of research, therefore, aims to understand the role of interfaces on the mechanical behavior of nanoscale multilayers 5-12 . Like grain boundaries in the nanocrystalline metals, bi-metallic interfaces are expected to result in significant differences in the deformation mechanisms of the multilayered microstructure as compared to their single-phase counterparts, by acting as sources or sinks for dislocation nucleation, or as barriers to dislocation propagation 13 . The capability of the bi-metallic interfaces to hinder dislocation propagation critically determines the strength of the multilayers 7,14 . This capability is also affected by the local atomic structure of the interface. For example, Zheng et al. 15 showed that for Cu/Nb multilayers, a faceted interface such as the KS112 interface could significantly promote twinning, due to the presence of atomic steps and the associated misfit dislocations with out-of-plane Burgers' vector that act as sources for nucleating twinning part...

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Section: Methodsmentioning

confidence: 99%

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confidence: 99%

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confidence: 99%

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Unraveling the Role of Interfaces on the Spall Failure of Cu/Ta Multilayered Systems

Chen

Mathaudhu

Thadhani

et al. 2020

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“…In this manuscript, we examined three representative metallic systems in order to feature three of the most important deformation modes for shocked FCC and BCC microstructures: dislocation slip (stacking faults), deformation twining, and phase transformation. When shocking Ta along [110], twins form during the compressive wave and are annihilated by the release wave 1 – 9 . In contrast, when shocking Fe along [110], the compressive wave induces an α (BCC) → ϵ (HCP) phase transformation, and then the release wave reverses this transformation and induces twins 10 – 13 .…”

Section: Introductionmentioning

confidence: 99%

Fingerprinting shock-induced deformations via diffraction

Mishra

Kunka

Echeverria

et al. 2021

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During the various stages of shock loading, many transient modes of deformation can activate and deactivate to affect the final state of a material. In order to fundamentally understand and optimize a shock response, researchers seek the ability to probe these modes in real-time and measure the microstructural evolutions with nanoscale resolution. Neither post-mortem analysis on recovered samples nor continuum-based methods during shock testing meet both requirements. High-speed diffraction offers a solution, but the interpretation of diffractograms suffers numerous debates and uncertainties. By atomistically simulating the shock, X-ray diffraction, and electron diffraction of three representative BCC and FCC metallic systems, we systematically isolated the characteristic fingerprints of salient deformation modes, such as dislocation slip (stacking faults), deformation twinning, and phase transformation as observed in experimental diffractograms. This study demonstrates how to use simulated diffractograms to connect the contributions from concurrent deformation modes to the evolutions of both 1D line profiles and 2D patterns for diffractograms from single crystals. Harnessing these fingerprints alongside information on local pressures and plasticity contributions facilitate the interpretation of shock experiments with cutting-edge resolution in both space and time.

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“…These include: deformation behavior of Ni/NiAl Kurdjumov-Sachs (KS) interfaces at various strain rates and temperatures by Choudhuri et al [8]; temperature effects on deformation behavior of grain boundaries in a polycrystalline microstructure by Smith and Farkas [9]; deformation behavior of various grain boundaries in bicrystal microstructures of yttria-stabilized tetragonal zirconia (YSTZ) by Zhang et al [10]; Hugoniot of CuZr metallic glasses for various impact velocity compositions of the microstructure by Wen et al [11]; structure and deformation mechanisms at the Kurdjumov-Sachs interface using a newly developed embedded atom method interatomic potential for Mg-Nb by Yadav et al [12]; and shock deformation and spallation failure behavior in a nanocrystalline Cu matrix as influenced by the size and distribution of nanoscale Cu/Ta interfaces by Chen et al [13].…”

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Understanding mechanical behavior of interfaces in materials

et al. 2018

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The response/performance of technologically relevant materials to mechanical loading environments in various applications is influenced and characterized by the presence and evolution of various interfaces. The fundamental understanding of the links between various characteristics of the interfaces (structural, chemical) and the mechanical response is a critical challenge in exploiting and tailoring new physical properties of materials for next-generation applications. The review papers and topical articles in this ''Special Issue on Interface Behavior'' emphasize the latest advances and also identify open questions and longer-term needs in the understanding of the mechanical behavior of interfaces in several thematic areas of materials research. The articles highlight the current experimental, theoretical and computational capabilities and limitations to understand various interface dominated phenomena and deformation mechanisms that determine the microstructural evolution and/or properties/behavior of materials across multiple scales. The various contributions through the review and topical articles are summarized below.The review article by Clayton [1] discusses the current capabilities of mesoscale modeling methods based on the representation of interfaces on predicted deformation and failure phenomena using continuum mechanics frameworks. This review emphasizes the effects of the description of grain boundaries, twinning and failure processes using a variety of continuum mechanics models.An ''atomistically informed interface dislocation dynamics (AIDD) model'' that incorporates the atomic-scale characteristics of dislocation nucleation,

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Role of nanoscale Cu/Ta interfaces on the shock compression and spall failure of nanocrystalline Cu/Ta systems at the atomic scales

Cited by 31 publications

References 66 publications

Unraveling the Role of Interfaces on the Spall Failure of Cu/Ta Multilayered Systems

Unraveling the Role of Interfaces on the Spall Failure of Cu/Ta Multilayered Systems

Fingerprinting shock-induced deformations via diffraction

Understanding mechanical behavior of interfaces in materials

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