Role of surfactants in adhesion reduction for step and flash imprint lithography

Lin, Min‐Der; Hellebusch, Daniel J.; Wu, Kai; Kim, Eui Kyoon; Lu, Kaijun; Liechti, Kenneth M.; Ekerdt, John G.; Ho, Paul S.; Willson, C. Grant

doi:10.1117/1.2968269

Cited by 14 publications

(11 citation statements)

References 15 publications

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“…The fracture energy is a characteristic property of the interface that is a function of loading phase angle [40]. The interfacial adhesion energy between polymer resin for UV NIL and mold material coated with various anti-sticking layers has been measured by using these methods [24,39,44,45]. The fracture energy measured with different test methods should be consistent for similar loading phase angles.…”

Section: Test Methodsmentioning

confidence: 99%

“…The work of adhesion (W a ) at an interface composed of two materials is equal to the surface generation energy S, and can be expressed in terms of surface energies as W a =S= γ 1 + γ 2 −2 γ 12 (1) where γ i is the surface energy of material i, and γ 12 is the interfacial surface energy of the interface [39]. This equation is valid for a reversible process, i.e., there is no dissipation of energy during bonding or debonding.…”

Section: Theory and Simulationmentioning

confidence: 99%

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Tribology issues in nanoimprint lithography

Kim

Lee

et al. 2010

J Mech Sci Technol

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Nanoimprint lithography (NIL) is one of the most promising technologies for nanofabrication because it can create nano-and microscale structures and devices in a cost-effective manner. In the NIL process, a mold with patterns on its surface comes in contact with a polymer film on a substrate. The patterns are transferred to the polymer film and then the mold is separated from the film. Mechanical contact between the mold and the polymer film, and between the film and the substrate, is inevitable. In some cases, during the separation process, adhesion and friction forces at the interfaces can deform and fracture the transferred patterns and detach the polymer film from the substrate. Thus, controlling the adhesion and friction between the materials in contact is very important in achieving a successful pattern transfer and making the NIL process a robust nanofabrication technique. Many theoretical and experimental research efforts have been made to clarify the tribological phenomena in NIL and to reduce defects due to adhesion and friction. This article describes the tribological problems encountered and reviews the related research.

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Section: Test Methodsmentioning

confidence: 99%

Section: Theory and Simulationmentioning

confidence: 99%

Tribology issues in nanoimprint lithography

Kim

Lee

et al. 2010

J Mech Sci Technol

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“…The mould may have a shorter life span than optical masks, due to physical pressure against a surface. These problems have been addressed by Chou et al [89,90] and others [91][92][93]. Another feature of nanoimprint molding is the bubble defect.…”

Section: The Future For Nanolithographymentioning

confidence: 97%

Sculpting Nanometric Patterns: The Top‐down Approach

Nunes

2010

Ideas in Chemistry and Molecular Sciences

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“…27 As a different approach to preventing release agent decomposition, an inorganic thin film release layer, such as DLC, was proposed. 28,29 Resist release property was also improved by adding to the resist an antisticking agent such as fluoroalkyl silane (which is the same as the mold release agent), 30 fluorine surfactant, 8,31,32 and fluorine monomer. 32,33 It was also found that reducing the elastic modulus is effective in reducing release force.…”

Section: Release Propertymentioning

confidence: 97%

Design considerations for ultraviolet-nanoimprint lithography resists

Usuki

Wakamatsu

Oomatsu

et al. 2012

J. Micro/Nanolith. MEMS MOEMS

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Design considerations for ultraviolet-nanoimprint lithography resists were investigated focusing on the major issues of ink-jetting performance, pattern formability, release property, and dry etching resistance. Regarding ink-jetting performance, small droplet ink-jetting of 0.7 pl was successfully demonstrated by adjusting the resist fluid property to the ink-jet coater and controlling the resist volatilization. Regarding pattern formability, a resist pattern was imprinted from a mold pattern of 28 nm in width and 60 nm in depth without pattern dimension change. It was thought that modulus control of the resist was more important than resist shrinkage in achieving excellent pattern formability. As for release property, resist with fluorine monomer and with nonreactive fluorine antisticking agent were compared. The results indicated that resist design has the capability to both reduce separation force and maintain a clear mold surface. The mold release agent decomposed with an increasing number of imprint shots, but the low release-force resist with nonreactive antisticking agent was able to control degradation of the mold release agent and thus improve release property endurance. Regarding etching resistance, it was found that increasing the ring parameter of resist is essential for high etching resistance, and resulted in improved etched pattern features of the substrate.

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Role of surfactants in adhesion reduction for step and flash imprint lithography

Cited by 14 publications

References 15 publications

Tribology issues in nanoimprint lithography

Tribology issues in nanoimprint lithography

Sculpting Nanometric Patterns: The Top‐down Approach

Design considerations for ultraviolet-nanoimprint lithography resists

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