Abstract:Although electrodeposition has emerged as a promising approach to make metal chalcogenide nanostructures, it has an underlying issue of exfoliating the deposits affixed to a conductive substrate, which is inevitable to transfer electrons for a reduction reaction, for precise characterization and advanced device fabrication. Herein, direct electrodeposition of metal chalcogenides on a silicon dioxide (SiO2) insulator and its device applications for a back‐gated field‐effect‐transistor and a nitrogen dioxide gas… Show more
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