Rolled‐Up Self‐Assembly of Compact Magnetic Inductors, Transformers, and Resonators

Karnaushenko, Dmitriy D.; Karnaushenko, Daniil; Grafe, H.-J.; Kataev, V.; Büchner, B.; Schmidt, Oliver G.

doi:10.1002/aelm.201800298

Cited by 33 publications

(66 citation statements)

References 28 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Similar to the thermally induced deformation, perforation increases the thermal resistance thus a higher rated current. S-RuM structures as an emerging self-assembled 3D architecture platform through 2D processing, have already been well understood in their formation mechanism at all scales [33,34] and used for a wide range of applications, including in passive electronics, [6,7,[11][12][13] optical measurement and sensing, [15][16][17][18]35,36] and biological cell growth. [5,37,38] This work represents advancement in the manipulation of these structures for thermal management, which is critical to applications in the field of 3D microelectromechanical systems.…”

Section: Sih G 4nh Gmentioning

confidence: 99%

“…S-RuM structures as an emerging self-assembled 3D architecture platform through 2D processing, have already been well understood in their formation mechanism at all scales [33,34] and used for a wide range of applications, including in passive electronics, [6,7,[11][12][13] optical measurement and sensing, [15][16][17][18]35,36] and biological cell growth. With the additions of perforation, thermal resistance increased dramatically.…”

mentioning

confidence: 99%

“…[1][2][3][4][5][6][7][8][9][10][11] Strain-induced Self-Rolled-up Membranes (S-RuM) are of great interest due to their CMOS-compatible planar fabrication process and versatile 3D architectures produced by selfassembly. S-RuM tubular structures have been used to fabricate miniaturized passive electronic and photonic components, such as inductors, [6,11,12] capacitors, [7] transformers, [12,13] and waveguides. [14][15][16][17] S-RuM structures are formed by releasing a strained bilayer from a sacrificial layer, resulting in a tubular structure comprised exclusively of the bilayer material.…”

mentioning

confidence: 99%

See 2 more Smart Citations

Effect of Perforation on the Thermal and Electrical Breakdown of Self‐Rolled‐Up Nanomembrane Structures

Michaels

Wood

Froeter

et al. 2019

Adv Materials Inter

View full text Add to dashboard Cite

Strain‐induced self‐rolled‐up membranes (S‐RuM) are structures formed spontaneously by releasing a strained layer or layer stacks from its mechanical support, with unique applications in passive photonics, electronics, and bioengineering. Depending on the thermal properties of the strained layers, these structures can experience various thermally induced deformations. These deformations can be avoided and augmented with the addition of strategically placed perforations in the membrane. This study reports on the use of perforations to modify the thermal effects on strained silicon nitride S‐RuM structures. A programmable fuse with well‐defined thermal threshold, ultrasmall footprint, and 2–3 V voltage rating is demonstrated, which can potentially serve as an on‐chip sensing device for power electronic circuits.

show abstract

Section: Sih G 4nh Gmentioning

confidence: 99%

mentioning

confidence: 99%

mentioning

confidence: 99%

See 1 more Smart Citation

Effect of Perforation on the Thermal and Electrical Breakdown of Self‐Rolled‐Up Nanomembrane Structures

Michaels

Wood

Froeter

et al. 2019

Adv Materials Inter

View full text Add to dashboard Cite

show abstract

“…Copyrights 2016, American Chemical Society), capacitors (3 ‐ Adapted with permission . Copyrights 2010, American Chemical Society), inductors, transformers, resonators (4,5 ‐ Adapted with permission . Copyright 2018, Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim), antennas (6 ‐ Adapted under the terms of the CC BY license .…”

Section: Introductionmentioning

confidence: 99%

“…By mimicking the self‐assembly and shapeability features of biological systems, a variety of artificial mesoscopic architectures, passive and active electronics, optical and magnetic functional blocks, and even entire systems were constructed (Figures c and c). With the help of compatible lithographic techniques and, more importantly, development of novel lithographically processable strain‐engineering materials and composites, the self‐assembly of micro‐ and nanoscale 3D architectures can be obtained by the shaping of initially planar structures .…”

Section: Introductionmentioning

confidence: 99%

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Karnaushenko

Kang

Schmidt

2019

Adv Materials Technologies

Self Cite

View full text Add to dashboard Cite

simple transistors and logics to highly integrated microcontrollers and displays, the latter of which utilizes some of the most technologically advanced processes available in the industry. [3] The success of these technologies has been achieved through enhanced integration of various active functional blocks such as transistors, digital logics, and analog circuits, along with advances in miniaturization and simplification of the overall manufacturing process, eventually leading to large scale, parallel fabrication of silicon chip-based microelectronic components and systems. [4,5] However, many of the manufacturing steps in assembling these electronic components remain either semiparallel or sequential in nature, including processes as dicing, pick and place, packaging, and final assembly of the device. Each additional sequential step increases costs and should ideally be avoided, however substantial streamlining is not always feasible in complex manufacturing processes. [6] More critically, highly integrated silicon-based devices still require several external supporting components for their operation such as wiring, powering, sensing, and communications that cannot be easily integrated within the planar surface of a silicon die. Thus, sensors, actuators, capacitors, coils, antennas, and optics, each crucial for the complete system, are typically placed separately from the silicon chip onto a printed circuit board (PCB), or integrated within another package (Figure 1a). While the need for ever decreasing sizes has demanded tremendous investments and efforts in the manufacture of completed assemblies, the miniaturizing of 3D electronic components (Figure 1b) and systems has nevertheless reached the range of mesoscopic sizes (<1 mm) where the manufacture and assembly of components experience challenges with respect to yield, costs, and reliability. [7] As a result, these issues limit the fabrication potential and commercial viability of components and systems to scales around 1 mm, [8] and despite efforts to improve the planar construction of mesoscopic 3D devices, the results are seen as inefficient and experience difficulties in achieving high performances while maintaining reasonable complexity. Despite the great success in manufacturing active electronics, such concerns are strongly related to the fabrication of passive electronic components like inductors, capacitors, antennas, and resonators where material properties (e.g., mechanical, magnetic, and electrical) and geometry play a crucial role. [8,9] In order to downscale these devices further and improve integration with active electronics, novel fabrication strategies are required.Electronic devices and their components are continually evolving to offer improved performance, smaller sizes, lower weight, and reduced costs, often requiring the state-of-the-art manufacturing and materials to do so. An emerging class of materials and fabrication techniques inspired by self-assembling biological systems shows promise as an alternative to the more traditional m...

show abstract

Amorphous Silicon Self‐Rolling Micro Electromechanical Systems: From Residual Stress Control to Complex 3D Structures

2019

View full text Add to dashboard Cite

In surface micromachining, the control of the residual stress of the films is crucial, as excessive stress can cause buckling, cracking, and peeling of the materials and fracture of the devices. However, the gradients of stress across the thickness of individual films or the stress mismatch in composite structural layers can be exploited to obtain highly complex 3D structures via self‐assembly, self‐bending, self‐positioning, or self‐rolling processes. Herein, the thin‐film residual stresses of amorphous silicon, TiW, AlSiCu, Cr, Au, and SiO2 are assessed using polymer substrates and tuned. Then, a stress‐mismatched bi‐layer of amorphous silicon (tensile) and TiW (compressive) is used in the fabrication of complex 3D self‐rolling micro electromechanical systems (MEMS) structures. The freestanding regions of the fabricated MEMS have a characteristic radius of curvature of ≈100 μm. Current‐induced thermal actuation of a suspended plate is demonstrated. The microfabrication process and materials used are compatible with standard cleanroom processing and with a variety of substrates. In the future, amorphous silicon photodiodes, photoconductors, or other semiconductor devices can be incorporated on complex MEMS fabricated by self‐rolling/self‐bending processes and applied to localized optical and electrical sensing.

show abstract

Rolled‐Up Self‐Assembly of Compact Magnetic Inductors, Transformers, and Resonators

Cited by 33 publications

References 28 publications

Effect of Perforation on the Thermal and Electrical Breakdown of Self‐Rolled‐Up Nanomembrane Structures

Effect of Perforation on the Thermal and Electrical Breakdown of Self‐Rolled‐Up Nanomembrane Structures

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Amorphous Silicon Self‐Rolling Micro Electromechanical Systems: From Residual Stress Control to Complex 3D Structures

Contact Info

Product

Resources

About