2021
DOI: 10.1016/j.microrel.2021.114067
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Rolling reliability of polyurethane and polyurethane-acrylic ICAs interconnections on printed stretchable electronics

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Cited by 3 publications
(2 citation statements)
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“…Fu et al compared failure models of two types of ICAs during the rolling mechanical test in their work. 81 The polyurethane-acrylic ICA has a strong bonding with the pins of the surface-mounted devices but delivered low adhesive force with printed Ag electrodes, whereas the polyurethane-based ICA showed the opposite behavior, making them liable to fail along the ICA/stretchable Ag traces and ICA/rigid chips interface delamination, respectively. Traditional rigid ICAs based on epoxy and metal nano/microparticles have shown stable performance for rigid and printed flexible printed circuit boards (PCBs), 82,83 but they have a huge mechanical property mismatch with the stretchable interconnects.…”
Section: Stress-concentrated Rigid–soft Interfacesmentioning
confidence: 99%
“…Fu et al compared failure models of two types of ICAs during the rolling mechanical test in their work. 81 The polyurethane-acrylic ICA has a strong bonding with the pins of the surface-mounted devices but delivered low adhesive force with printed Ag electrodes, whereas the polyurethane-based ICA showed the opposite behavior, making them liable to fail along the ICA/stretchable Ag traces and ICA/rigid chips interface delamination, respectively. Traditional rigid ICAs based on epoxy and metal nano/microparticles have shown stable performance for rigid and printed flexible printed circuit boards (PCBs), 82,83 but they have a huge mechanical property mismatch with the stretchable interconnects.…”
Section: Stress-concentrated Rigid–soft Interfacesmentioning
confidence: 99%
“…Reliability issues with hybrid electronics can occur due to mechanical mismatch between soft and rigid components. 74) This occurred in the earlier mentioned elastic ECG system, 68) which is another case where computer modeling was employed for reliability assessment. Finite element modeling (FEM) was used to complement experimental testing of device performance under tensile load.…”
Section: Reliabilitymentioning
confidence: 99%