2000
DOI: 10.1016/s0925-4005(00)00351-8
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Room temperature bonding of micromachined glass devices for capillary electrophoresis

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Cited by 55 publications
(49 citation statements)
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“…In addition, many research groups have reported the bonding of glass microchips at room temperature without the requirements of cleanroom facilities [16,[32][33][34][35][36]. Such reported processes are strongly dependents of some factors as (i) multiple washing steps [32,33,35], (ii) need of an accurate holder to apply an equalized pressure between two glass plates [34] and (iii) still requiring instrumentation for sequential plasma activation of the glass surface [36]. However, all roomtemperature bonding processes demand high level of cleanliness and flatness of the glass surfaces [32][33][34][35][36].…”
Section: Introductionmentioning
confidence: 99%
“…In addition, many research groups have reported the bonding of glass microchips at room temperature without the requirements of cleanroom facilities [16,[32][33][34][35][36]. Such reported processes are strongly dependents of some factors as (i) multiple washing steps [32,33,35], (ii) need of an accurate holder to apply an equalized pressure between two glass plates [34] and (iii) still requiring instrumentation for sequential plasma activation of the glass surface [36]. However, all roomtemperature bonding processes demand high level of cleanliness and flatness of the glass surfaces [32][33][34][35][36].…”
Section: Introductionmentioning
confidence: 99%
“…In addition to etching, through-holes in glass wafers can be made by drilling and powder blasting (Belloy, Sayah, & Gijs, 2000). In general, glass-glass bonding is considered easier than silicon-silicon or polymer-polymer bonding because of the wide variety of methods available for glass (Chiem et al, 2000;Daridon et al, 2001;Jia, Fang, & Fang, 2004;Easley, Humphrey, & Landers, 2007;Tiggelaar et al, 2007). Silicon-glass anodic bonding is also a routine task (Despont et al, 1996;Berthold et al, 2000;Lee et al, 2000).…”
Section: Glassmentioning
confidence: 99%
“…Bonding without an intermediate layer, known as direct or fusion bonding, is simple in the sense that no foreign material is introduced to the process and the number of material interfaces is minimized. Silicon-silicon (Christiansen, Singh, & Gösele, 2006), glass-glass (Xue et al, 1997;Chiem et al, 2000;Jia, Fang, & Fang, 2004), quartz-quartz , PMMA-PMMA (Chen et al, 2004), and many other direct bonding processes are in use. The most general purpose bonding technique, however, is adhesive bonding (Niklaus et al, 2001a(Niklaus et al, , 2006, where an intermediate layer of material is added to the system to facilitate bonding.…”
Section: Bondingmentioning
confidence: 99%
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“…The separation channel was 120 mm wide, whereas the narrow bead introduction channel (50 or 30 mm wide) was used to deliver packing material. After drilling 2 mm diameter access holes on a 600-mm-thick Corning 0211 glass or 2-mm-thick quartz cover plates, the etched substrate was thermally bonded to the matching cover plate [28]. The channels were conditioned with 0.1 M NaOH (10 min) and doubly distilled water (10 min) before use.…”
Section: Reagentsmentioning
confidence: 99%