Room temperature bonding of Polymethylglutarimide for layer transfer method

Matsumae, Takashi; Suga, Tadatomo

doi:10.1109/icep.2016.7486836

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2023

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“…The LOR formula is known and shown in Figure 4. This polymer has been used for 3D integration and the transfer of thin film materials with a Surface Activated Bonding process (SAB) (17). Moreover, temporary bonding by thermal compression has been realized with LOR resin with a thickness between 4.2 and 7 µm (18).…”

Section: Resultsmentioning

confidence: 99%

Polymer to Silicon Direct Bonding for Microelectronics

Dautriat,

Montméat,

Fournel

2023

ECS Trans.

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Direct bonding consists in spontaneously bringing into contact two solid surfaces without any intermediate liquid. We focused on silicon direct bonding with polymer films. Direct bonding was evaluated with two polymers: LOR (MicroChem) and BARC (Rohm & Haas), commonly used in photolithography. Polymer bonding by thermal compression was compared to polymer direct bonding. Adhesion energies and bonding wave velocities of bonding between polymers and silicon surfaces were determined. The bonded stacks exhibited good quality bonding interfaces in terms of defects. High adherence energies up to 10 J/m² were measured.

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Section: Resultsmentioning

confidence: 99%