Room-Temperature Cu Microjoining Using Ultrasonic Bonding of Cone Shaped Bump

Qiu, Li; Asano, Tanemasa; Noda, Kei; Nakai, Seiya

doi:10.7567/ssdm.2012.k-4-2

Extended Abstracts of the 2012 International Conference on Solid State Devices and Materials 2012

DOI: 10.7567/ssdm.2012.k-4-2

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Room-Temperature Cu Microjoining Using Ultrasonic Bonding of Cone Shaped Bump

Li Qiu¹,

Tanemasa Asano²,

Kei Noda³

et al.

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2013

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“…The use of cone-shaped microbumps enabled Cu-Cu bonding at room temperature by assisting the deformation of cone-shaped bumps using a slit in the counterelectrode 16) or applying ultrasonic vibration. 17,18) In this work, experiments were carried out using ultrasonic bonding.…”

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confidence: 99%

Effect of Coating Self-Assembled Monolayer on Room-Temperature Bonding of Cu Micro-Interconnects

Qiu

Ikeda

Asano

2013

Jpn. J. Appl. Phys.

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The effect of coating the surface of a Cu microbump with a 1-hexanethiol self-assembled monolayer (SAM) on room-temperature solid-phase bonding was investigated. The microbump was cone-shaped while the counterelectrode was planar. Room-temperature bonding was performed by applying ultrasonic vibration. Chemical analysis showed that the SAM coating suppressed the surface oxidation of Cu. However, it was shown that the SAM coating also reduced the mechanical strength of the bonded interface, whereas little effect was observed in the electrical resistance of bump interconnects.

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mentioning

confidence: 99%

Effect of Coating Self-Assembled Monolayer on Room-Temperature Bonding of Cu Micro-Interconnects

Qiu

Ikeda

Asano

2013

Jpn. J. Appl. Phys.

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Room-Temperature Cu Microjoining Using Ultrasonic Bonding of Cone Shaped Bump

Cited by 1 publication

References 0 publications

Effect of Coating Self-Assembled Monolayer on Room-Temperature Bonding of Cu Micro-Interconnects

Effect of Coating Self-Assembled Monolayer on Room-Temperature Bonding of Cu Micro-Interconnects

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