The reliable and regular modification of the surface
properties
of substrates plays a crucial role in material research and the development
of functional surfaces. A key aspect of this is the development of
the surface pores and topographies. These can confer specific advantages
such as high surface area as well as specific functions such as hydrophobic
properties. Here, we introduce a combination of nanoscale self-assembled
block-copolymer-based metal oxide masks with optimized deep reactive
ion etching (DRIE) of silicon to permit the fabrication of porous
topographies with aspect ratios of up to 50. Following the evaluation
of our procedure and involved parameters using various techniques,
such as AFM or SEM, the suitability of our features for applications
relying on high light absorption as well as efficient thermal management
is explored and discussed in further detail.