Compliant structures have been fabricated in which a thin GaAs layer (thickness between 10 and 20 nm) was bonded on top of a GaAs substrate with a large twist angle (about 37°). This twist angle value was chosen so that the energy of the boundary (coincident boundary of type Sˆ5 …001 †) was minimized. The structure of the interface was characterized and the onset of plasticity in such a compliant substructure was investigated using nanoindentation that allowed the low-load deformation regime to be observed. The results are compared with those obtained under the same conditions on a GaAs bulk substrate alone. No plastic zone was observed by transmission electron microscopy in the compliant structure under loads below 0.25 mN while, under the same loads, plastic deformation was observed in the bulk substrate. For higher loads (2 mN), plastic-¯ow enhancement was observed in the compliant structure. The results are discussed in the light of the arrangement of dislocations observed in the plastic zones. } 1. Introduction Heteroepitaxy of III±V semiconductors is commonly used to fabricate electronic and optoelectronic devices that require materials of high structural quality. Above a critical thickness of the layers (which decreases rapidly with increasing mis®t), the epitaxial layers relax plastically through the introduction of mis®t dislocations at the interface. Unfortunately, this relaxation process also generates a large density of threading dislocations extending from the interface with the substrate to the top surface of the heterostructure. These dislocations adversely a ect the performance of the devices. The various procedures tried to eliminate the dislocations in standard epitaxy have so far remained insu ciently e ective.The compliant substrate was introduced to overcome this problem. The original idea was to relax the mis®t strain in a small region underneath the active region. The ideal situation is a free-standing layer set on the original substrate that can deform elastically, or even plastically, to relax the mis®t strain between the substrate and the Philosophical Magazin e Letters ISSN